3D Model Datasheet

AR376RAA Series

Outgassing Compliant Chip Inductors

AR376RAA Series features exceptionally high Q factors and outstanding self-resonant frequency.

Standard tin-lead (Sn‑Pb) terminations ensures the best possible board adhesion. Note: Nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended for hand soldering applications.
Passes NASA low outgassing specifications
Exceptionally high Q factors
Outstanding self-resonant frequency
Tight inductance tolerance
High temperature materials allow operation in ambient temperatures up to 155°C.

Looking for AE/ML/MS versions of this series? They have been replaced by the AR376RAA. Customers who have previously purchased the AE/ML/MS will be supported indefinitely.

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Specifications

Electrical specifications at 25°C.

Part is not compliant with MIL-STD-981 Family 50, Class S due to wire gauge.

Part number 1	Inductance (nH) 2	Tolerance (%)	Q min 3	SRF min (MHz) 4	DCR max (Ω) 5	Imax (mA)
Part number 1	Inductance (nH) 2	Tolerance (%)	Q min 3	SRF min (MHz) 4	DCR max (Ω) 5	Imax (mA)
AR376RAA030JPZ	3.3 @ 100 MHz	5	29 @ 300 MHz	5000	0.050	900
AR376RAA060JPZ	6.8 @ 100 MHz	5	24 @ 300 MHz	4380	0.070	900
AR376RAA100JPZ	10 @ 100 MHz	5,2,1	31 @ 300 MHz	3440	0.080	900
AR376RAA120JPZ	12 @ 100 MHz	5,2,1	40 @ 300 MHz	2560	0.10	900
AR376RAA150JPZ	15 @ 100 MHz	5,2,1	38 @ 300 MHz	2520	0.10	900
AR376RAA180JPZ	18 @ 100 MHz	5,2,1	50 @ 300 MHz	2260	0.10	900
AR376RAA220JPZ	22 @ 100 MHz	5,2,1	50 @ 300 MHz	2120	0.10	900
AR376RAA270JPZ	27 @ 100 MHz	5,2,1	50 @ 300 MHz	1800	0.11	900
AR376RAA330JPZ	33 @ 100 MHz	5,2,1	55 @ 300 MHz	1800	0.11	900
AR376RAA390JPZ	39 @ 100 MHz	5,2,1	55 @ 300 MHz	1800	0.12	900
AR376RAA470JPZ	47 @ 100 MHz	5,2,1	55 @ 300 MHz	1500	0.13	900
AR376RAA560JPZ	56 @ 100 MHz	5,2,1	55 @ 300 MHz	1400	0.14	900
AR376RAA680JPZ	68 @ 100 MHz	5,2,1	48 @ 150 MHz	1180	0.26	600
AR376RAA820JPZ	82 @ 100 MHz	5,2,1	52 @ 150 MHz	1120	0.21	700
AR376RAA101JPZ	100 @ 100 MHz	5,2,1	55 @ 150 MHz	1040	0.26	650
AR376RAA121JPZ	120 @ 100 MHz	5,2,1	53 @ 150 MHz	1040	0.26	620
AR376RAA151JPZ	150 @ 100 MHz	5,2,1	53 @ 150 MHz	920	0.31	720
AR376RAA181JPZ	180 @ 50.0 MHz	5,2,1	53 @ 150 MHz	780	0.43	580
AR376RAA221JPZ	220 @ 50.0 MHz	5,2,1	51 @ 150 MHz	700	0.50	550
AR376RAA271JPZ	270 @ 50.0 MHz	5,2,1	53 @ 150 MHz	630	0.56	470
AR376RAA331JPZ	330 @ 50.0 MHz	5,2,1	30 @ 35.0 MHz	570	0.62	370
AR376RAA391JPZ	390 @ 50.0 MHz	5,2,1	31 @ 35.0 MHz	540	0.75	370
AR376RAA471JPZ	470 @ 50.0 MHz	5,2,1	31 @ 35.0 MHz	500	1.3	320
AR376RAA561JPZ	560 @ 35.0 MHz	5,2,1	31 @ 35.0 MHz	440	1.3	300
AR376RAA621JPZ	620 @ 35.0 MHz	5,2,1	32 @ 35.0 MHz	440	1.6	270
AR376RAA681JPZ	680 @ 35.0 MHz	5,2,1	32 @ 35.0 MHz	410	1.6	260
AR376RAA751JPZ	750 @ 35.0 MHz	5,2,1	32 @ 35.0 MHz	400	2.2	220
AR376RAA821JPZ	820 @ 35.0 MHz	5,2,1	31 @ 35.0 MHz	370	1.8	240
AR376RAA911JPZ	910 @ 35.0 MHz	5,2,1	31 @ 35.0 MHz	350	2.9	190
AR376RAA102JPZ	1000 @ 35.0 MHz	5,2,1	32 @ 35.0 MHz	360	2.8	190
AR376RAA122JPZ	1200 @ 35.0 MHz	5,2,1	32 @ 35.0 MHz	320	3.2	170

Notes

When ordering, please specify tolerance, termination and screening codes: e.g. AR376RAA122JPZ.
Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
Q measured using an Agilent/HP 4291A impedance Analyzer with an Agilent/HP 16197A test fixture or equivalents.
SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft CCF1297 test fixture.
DCR measured on a micro-ohmmeter.

Tolerance:

F = 1%
G = 2%
J = 5%

Termination:

For hand soldering applications, the nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended. Exposed gold or tin in the terminations migrates into the solder.

P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.
C = Tin-lead (63/37) over gold over nickel over moly-mag.
S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
A = Gold over nickel over moly-mag.
L = Silver-palladium-platinum-glass frit.

Screening:

Z = Unscreened
H = Coilcraft CP-SA-10001 Group A
1 = EEE-INST-002 (Family 3) Level 1
2 = EEE-INST-002 (Family 3) Level 2
3 = EEE-INST-002 (Family 3) Level 3
4 = MIL-STD-981 (Family 50) Class B
5 = MIL-STD-981 (Family 50) Class S
Screening performed to the document’s latest revision.
Lot qualification (Group B) available.
Country of origin restrictions available; prefix options G or F.

Environmental

Ambient temperature range:

–55°C to +125°C with Imax current

Storage temperature range:

Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C

Maximum part temperature:

+155°C (ambient + temp rise)

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

See FIT/MTBF Calculations

Performance curves

L vs Frequency

Q vs Frequency

Physical characteristics

A max	B max	C max	D ref	E	F	G	H	I	J
0.140	0.085	0.060	0.020	0.056	0.020	0.080	0.076	0.040	0.070	inches
3,56	2,16	1,52	0,51	1,42	0,51	2,03	1,93	1,02	1,78	mm

Dimensions are before optional solder application.
For maximum height dimension including solder, add 0.0025 in / 0,64 mm to B and 0.0060 in / 0,15 mm to A and C.

General specification

Core Material:

Ceramic

Weight:

16.5 – 26.5 mg

Packaging:

2000 per 7″ reel Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.

Temperature coefficient of inductance:

+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity)

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.

Refer to Soldering Coilcraft Components before soldering.