Close up of AR376RAA911JPZ
3D Model Datasheet
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AR376RAA911

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) Q min
@ 35.0 MHz 3
SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
AR376RAA911JPZ 910 5,2,1 31 350 2.9 190
Notes
  1. When ordering, please specify tolerance, termination and screening codes: e.g. AR376RAA122JPZ.
  2. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured using an Agilent/HP 4291A impedance Analyzer with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft CCF1297 test fixture.
  5. DCR measured on a micro-ohmmeter.

Tolerance:

  • F = 1%
  • G = 2%
  • J = 5%

Termination:

For hand soldering applications, the nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended. Exposed gold or tin in the terminations migrates into the solder.
  • P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.
  • C = Tin-lead (63/37) over gold over nickel over moly-mag.
  • S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
  • A = Gold over nickel over moly-mag.
  • L = Silver-palladium-platinum-glass frit.

Screening:

  • Z = Unscreened
  • = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

Physical characteristics

ar376raad.gif
 
A max B max C max D ref E F G H I J  
0.140 0.085 0.060 0.020 0.056 0.020 0.080 0.076 0.040 0.070 inches
3,56 2,16 1,52 0,51 1,42 0,51 2,03 1,93 1,02 1,78 mm

Dimensions are before optional solder application.
For maximum height dimension including solder, add 0.0025 in / 0,64 mm to B and 0.0060 in / 0,15 mm to A and C.

General specification

Core Material:
Ceramic
Weight:
16.5 – 26.5 mg
Packaging:
2000 per 7″ reel Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.