3D Model
Datasheet
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) |
Q min
@ 150 MHz 3 |
SRF min (MHz) 4 | DCR max (mΩ) 5 | Imax (mA) |
|---|---|---|---|---|---|---|
| AR376RAA680JPZ | 68 | 5,2,1 | 48 | 1180 | 260 | 600 |
Notes
- When ordering, please specify tolerance, termination and screening codes: e.g. AR376RAA122JPZ.
- Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
- Q measured using an Agilent/HP 4291A impedance Analyzer with an Agilent/HP 16197A test fixture or equivalents.
- SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft CCF1297 test fixture.
- DCR measured on a micro-ohmmeter.
Tolerance:
- F = 1%
- G = 2%
- J = 5%
Termination:
For hand soldering applications, the nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended. Exposed gold or tin in the terminations migrates into the solder.- P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.
- C = Tin-lead (63/37) over gold over nickel over moly-mag.
- S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
- A = Gold over nickel over moly-mag.
- L = Silver-palladium-platinum-glass frit.
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- 1 = EEE-INST-002 (Family 3) Level 1
- 2 = EEE-INST-002 (Family 3) Level 2
- 3 = EEE-INST-002 (Family 3) Level 3
- 4 = MIL-STD-981 (Family 50) Class B
- 5 = MIL-STD-981 (Family 50) Class S
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
Q vs Frequency
Physical characteristics
| A max | B max | C max | D ref | E | F | G | H | I | J | |
|---|---|---|---|---|---|---|---|---|---|---|
| 0.140 | 0.085 | 0.060 | 0.020 | 0.056 | 0.020 | 0.080 | 0.076 | 0.040 | 0.070 | inches |
| 3,56 | 2,16 | 1,52 | 0,51 | 1,42 | 0,51 | 2,03 | 1,93 | 1,02 | 1,78 | mm |
Dimensions are before optional solder application.
For maximum height dimension including solder, add 0.0025 in / 0,64 mm to B and 0.0060 in / 0,15 mm to A and C.
General specification
Core Material:
Ceramic
Weight:
16.5 – 26.5 mg
Packaging:
2000 per 7″ reel Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.