Datasheet 3D Model

AR413RAD Series

Outgassing Compliant Chip Inductors

This robust version of Coilcraft’s standard 1008HQ series features high temperature materials that pass NASA low outgassing specifications and allow operation in an ambient temperature range of –55°C to 155°C. The standard tin-lead (Sn-Pb) terminations over leach-resistant base metalization ensures the best possible board adhesion.

All parts are compliant with MIL-STD-981 Family 50, Class S.

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Specifications

Electrical specifications at 25°C.

Part is wound on low profile coilform.

Part number 1	Inductance (nH) 2	Tolerance (%)	Q min 3	SRF min (GHz) 4	DCR max (mΩ) 5	Imax (A)
Part number 1	Inductance (nH) 2	Tolerance (%)	Q min 3	SRF min (GHz) 4	DCR max (mΩ) 5	Imax (A)
AR413RAD3N0_PZ	3.0	5	57 @ 1000 MHz	5.00	38	1.8
AR413RAD4N1_PZ	4.1	5	75 @ 1000 MHz	5.00	50	1.8
AR413RAD7N8_PZ	7.8	5	51 @ 500 MHz	3.80	50	1.6
AR413RAD10N_PZ	10	5,2	60 @ 500 MHz	3.20	60	1.5
AR413RAD12N_PZ	12	5,2	57 @ 500 MHz	2.40	60	1.5
AR413RAD18N_PZ	18	5,2	62 @ 350 MHz	2.10	70	1.4
AR413RAD22N_PZ	22	5,2	62 @ 350 MHz	2.05	70	1.4
AR413RAD33N_PZ	33	5,2	49 @ 150 MHz	1.70	90	1.2
AR413RAD36N_PZ	36	5,2	57 @ 150 MHz	1.40	90	1.1
AR413RAD39N_PZ	39	5,2	45 @ 150 MHz	1.30	90	1.1
AR413RAD47N_PZ	47	5,2,1	45 @ 150 MHz	1.45	120	0.95
AR413RAD56N_PZ	56	5,2,1	43 @ 150 MHz	1.08	120	0.95
AR413RAD68N_PZ	68	5,2,1	54 @ 150 MHz	1.15	130	0.85
AR413RAD82N_PZ	82	5,2,1	54 @ 150 MHz	1.06	160	0.80
AR413RADR10_PZ	100	5,2,1	51 @ 150 MHz	0.82	160	0.80

Notes

When ordering, please specify tolerance, termination and screening codes: e.g. AR413RADR10JPZ.
Inductance measured at 50 MHz using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
Q measured using an Agilent/HP 4291A with an AgilentHP 16197A test fixture or equivalents.
SRF measured using an Aglilent/HP 8753ES network analyzeror equivalent and a Coilcraft CCF1502 test fixture.
DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.

Tolerance:

F = 1%
G = 2%
J = 5%

Termination:

P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
L = Silver-palladium-platinum-glass frit.

Screening:

Z = Unscreened
H = Coilcraft CP-SA-10001 Group A
1 = EEE-INST-002 (Family 3) Level 1
2 = EEE-INST-002 (Family 3) Level 2
3 = EEE-INST-002 (Family 3) Level 3
4 = MIL-STD-981 (Family 50) Class B
5 = MIL-STD-981 (Family 50) Class S
F = ESCC3201 (F4 operational life performed at 90°C)
Screening performed to the document’s latest revision.
Lot qualification (Group B) available.
Custom testing also available.
Country of origin restrictions available; prefix option G or F.

Environmental

Ambient temperature range:

–55°C to +125°C with Imax current

Storage temperature range:

Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C

Maximum part temperature:

+155°C (ambient + temp rise)

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

See FIT/MTBF Calculations

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:

Ceramic

Packaging:

2000/7″reel;
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth;
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.

Temperature coefficient of inductance:

+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity)

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.

Refer to Soldering Coilcraft Components before soldering.