Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) |
Q min
@ 350 MHz 3 |
SRF min (GHz) 4 | DCR max (mΩ) 5 | Imax (A) |
|---|---|---|---|---|---|---|
| AR413RAD22N_PZ | 22 | 5,2 | 62 | 2.05 | 70 | 1.4 |
Notes
- When ordering, please specify tolerance, termination and screening codes: e.g. AR413RADR10JPZ.
- Inductance measured at 50 MHz using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
- Q measured using an Agilent/HP 4291A with an AgilentHP 16197A test fixture or equivalents.
- SRF measured using an Aglilent/HP 8753ES network analyzeror equivalent and a Coilcraft CCF1502 test fixture.
- DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.
Tolerance:
- F = 1%
- G = 2%
- J = 5%
Termination:
- P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
- S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
- L = Silver-palladium-platinum-glass frit.
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- 1 = EEE-INST-002 (Family 3) Level 1
- 2 = EEE-INST-002 (Family 3) Level 2
- 3 = EEE-INST-002 (Family 3) Level 3
- 4 = MIL-STD-981 (Family 50) Class B
- 5 = MIL-STD-981 (Family 50) Class S
- F = ESCC3201 (F4 operational life performed at 90°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
- Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
Physical characteristics
Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.
General specification
Core Material:
Ceramic
Packaging:
2000/7″reel;
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth;
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth;
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.