Close up of AR413RADR10_PZ
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AR413RADR10

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) Q min
@ 150 MHz 3
SRF min (MHz) 4 DCR max (mΩ) 5 Imax (A)
AR413RADR10_PZ 100 5,2,1 51 820.00 160 0.80
Notes
  1. When ordering, please specify tolerance, termination and screening codes: e.g. AR413RADR10JPZ.
  2. Inductance measured at 50 MHz using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured using an Agilent/HP 4291A with an AgilentHP 16197A test fixture or equivalents.
  4. SRF measured using an Aglilent/HP 8753ES network analyzeror equivalent and a Coilcraft CCF1502 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.

Tolerance:

  • F = 1%
  • G = 2%
  • J = 5%

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
  • L = Silver-palladium-platinum-glass frit.

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Custom testing also available.
  • Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

ar413rad_dim.GIF
Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:
Ceramic
Packaging:
2000/7″reel;
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth;
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.