Datasheet 3D Model
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Electrical specifications at 25°C.

Part number Inductance (µH) 1
(Tolerance: ±5%)
Q typ
@ 790 kHz 2
SRF min (MHz) 3 DCR max (Ω) 4 Imax (mA)
MS450RAB823JSZ 82 24 9.0 7.0 135
  1. Inductance at 2.5 MHz measured using an Agilent/HP 4286A and a Coilcraft SMD-A fixture with Coilcraft-provided correlation pieces. Inductance at 0.79 MHz measured using an Agilent/HP 4192A and Coilcraft SMD-B test fixture.
  2. Q read at test frequency directly on an Agilent/HP 4192A LF impedance analyzer and a Coilcraft SMD-B test fixture.
  3. SRF measured using an Agilent/HP 8753D network analyzer and a Coilcraft SMD-D test fixture.
  4. DCR measured on a Cambridge Technology micro-ohmmeter.
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

Physical characteristics

A max B max C max D ref E F G H I J  
0.195 0.150 0.135 0.070 0.100 0.025 0.128 0.120 0.045 0.118 inches
4,95 3,81 3,43 1,78 2,54 0,64 3,25 3,05 1,14 3,00 mm
Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:
600 per 7′′ reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 3.7 mm pocket depth
Temperature coefficient of inductance:
+200 to +700 ppm/°C.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.