Datasheet 3D Model
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The ML336RAM Series is not recommended for new designs, but existing customers will continue to be supported. As an alternative, we recommend the AR336RAM Series which is a drop-in replacement.

For more information and specification about the part.

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Electrical specifications at 25°C.

Part number Inductance (µH) 1
(Tolerance: ±5%)
Impedance typ (Ω)
@ 50.0 MHz
Q min
@ 7.9 MHz 2
SRF min (MHz) 3 DCR max (Ω) 4 Imax (mA) Color code
ML336RAM272JRZ 2.7 1050 15 80.0 1.16 190 Violet
  1. Inductance measured at 0.1 Vrms, using Coilcraft SMD-A fixture in Agilent/HP 4286A impedance analyzer or equivalent with Coilcraftprovided correlation pieces.
  2. Q measured on Agilent/HP 4291A with Agilent/HP 16197A test fixture or equivalents.
  3. SRF measured using Agilent/HP 8753ES network analyzer or equivalent with Coilcraft CCF1297 test fixture.
  4. DCR measured on a Keithley 580 Micro-ohmmeter or equivalent with a Coilcraft CCF858 test fixture.
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +155°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Impedance vs Frequency

L vs Frequency

Q vs Frequency

Physical characteristics

A max B max C max D ref E F G H I J  
0.090 0.068 0.060 0.020 0.050 0.016 0.040 0.070 0.040 0.030 inches
2,29 1,73 1,52 0,51 1,27 0,41 1,02 1,78 1,02 0,76 mm
Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:
16.7– 18.0 mg
2000/7″reel; Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.