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3D Model Datasheet

AR336RAM Series

Chip Inductors for Critical Applications

AR336RAM Series features ferrite construction for high current handling.
  • High temperature materials allow operation in ambient temperatures up to 140°C.
  • Passes NASA low outgassing specifications
  • Standard tin-lead (Sn-Pb) terminations ensure the best possible board adhesion. Note: Nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended for hand soldering applications.
Looking for the ML version of this series?  It has been replaced by the AR336RAM. Customers who have previously purchased the ML will be supported indefinitely.

Looking for the commercial version of this part? See Coilcraft 0805AF Series
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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±5%) 		Impedance typ (Ω) Q min 3 SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
AR336RAM111JPZ 0.11 @ 7.9 MHz 370 @ 500 MHz 14 @ 7.9 MHz 1000 0.05 700
AR336RAM681JPZ 0.68 @ 7.9 MHz 430 @ 100 MHz 15 @ 7.9 MHz 340 0.30 410
AR336RAM102JPZ 1.0 @ 7.9 MHz 670 @ 100 MHz 13 @ 7.9 MHz 280 0.39 360
AR336RAM122JPZ 1.2 @ 7.9 MHz 860 @ 100 MHz 15 @ 7.9 MHz 300 0.64 260
AR336RAM152JPZ 1.5 @ 7.9 MHz 1000 @ 100 MHz 16 @ 7.9 MHz 225 0.74 250
AR336RAM182JPZ 1.8 @ 7.9 MHz 1360 @ 100 MHz 16 @ 7.9 MHz 240 0.98 210
AR336RAM222JPZ 2.2 @ 7.9 MHz 840 @ 50.0 MHz 15 @ 7.9 MHz 90 0.98 190
AR336RAM272JPZ 2.7 @ 7.9 MHz 1050 @ 50.0 MHz 15 @ 7.9 MHz 80 1.16 190
AR336RAM332JPZ 3.3 @ 7.9 MHz 1670 @ 50.0 MHz 15 @ 7.9 MHz 65 1.20 190
AR336RAM472JPZ 4.7 @ 7.9 MHz 950 @ 25.0 MHz 14 @ 7.9 MHz 40 1.50 170
AR336RAM682JPZ 6.8 @ 7.9 MHz 450 @ 10.0 MHz 14 @ 7.9 MHz 28 1.90 150
AR336RAM103JPZ 10 @ 2.5 MHz 740 @ 10.0 MHz 14 @ 2.5 MHz 18 2.20 130
AR336RAM153JPZ 15 @ 2.5 MHz 1300 @ 10.0 MHz 13 @ 2.5 MHz 15 4.25 90
AR336RAM223JPZ 22 @ 2.5 MHz 1620 @ 10.0 MHz 13 @ 2.5 MHz 15 6.70 75
Notes
  1. When ordering, please specify  screening code: e.g. AR336RAM223JPZ.
  2. Inductance measured at 0.1 Vrms, using Coilcraft SMD-A fixture in Agilent/HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured on Agilent/HP 4291A with Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using Agilent/HP 8753ES network analyzer or equivalent with Coilcraft SMD-D test fixture.
  5. DCR measured on a Keithley 580 Micro-ohmmeter or equivalent with a Coilcraft CCF858 test fixture.

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Custom testing also available. 
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +140°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
See FIT/MTBF Calculations

Performance curves

Inductance vs Frequency

Inductance vs Frequency

Q vs Frequency

Q vs Frequency

Impedance vs Frequency

Impedance vs Frequency

Physical characteristics

st336ramd.gif
 
A max B max C max D ref E F G H I J  
0.090 0.071 0.060 0.020 0.050 0.016 0.040 0.070 0.040 0.030 inches
2,29 1,80 1,52 0,51 1,27 0,41 1,02 1,78 1,02 0,76 mm
Note: Dimensions are before optional solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:
Ferrite
Weight:
16.7– 21.7 mg
Packaging:
2000/7″ reel; Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.