Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±10%) |
DCR max (Ω) 3 | SRF typ (MHz) 4 | Isat (A) 5 | Irms (A) 6 |
|---|---|---|---|---|---|
| ST336PHA103KLZ | 10 | 1.51 | 66 | 0.27 | 0.43 |
Notes
- When ordering, please specify termination and screening codes: e.g. ST336PHA334KLZ.
- Inductance measured at 100 kHz, 0.1 Vrms, using a Coilcraft SMD -A fixture in Agilent/HP 4263B LCR meter.
- DCR measured on a micro-ohmmeter and a Coilcraft CCF858 test fixture.
- SRF measured using an Agilent/HP 8753D network analyzer and a Coilcraft CCF1297 test fixture.
- DC current at which the inductance drops 10% (typ) from its value without current. This information is for reference only and does not represent absolute maximum ratings.
- Current that causes a 40°C temperature rise from 25°C ambient.
Termination:
- L = Silver-palladium-platinum-glass frit.
- T = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
- S = Tin-lead (63/37). (Special order, added cost)
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Group A screening per Coilcraft CP-SA-10001
- G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
Environmental
Ambient temperature range:
–40°C to +65°C with Irms current.
Storage temperature range:
Component: –55°C to +105°C.
Packaging: –55°C to +80°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+105°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical L vs Current
Typical Q vs Frequency
General specification
Core Material:
Ceramic/Ferrite
Weight:
57.6– 62.4 mg
Packaging:
1500/7″ reel; 7500/13″ reel Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 2.34 mm pocket depth.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.