Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (nH)
2
(Tolerance: ±15%) |
DCR ± 10% (mΩ) 3 | SRF typ (MHz) | Isat (A) 4 | Irms (A) 5 | |||
|---|---|---|---|---|---|---|---|---|
| at 25°C | at 100°C | at 125°C | 20°C rise | 40°C rise | ||||
| ST464PMR101LEZ | 100 | 0.32 | 70 | 18.5 | 17.0 | 15.6 | 24 | 40 |
Notes
- When ordering, please specify screening code: ST464PMR101LEZ
- Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
- DCR is measured on a micro-ohmmeter at points indicated in the diagram below.
- DC current that causes an inductance drop of 20% (typ) from its value without current.
- Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, air flow, and proximity to other components. Therefore temperature rise should be verified in application conditions.
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Group A screening per Coilcraft CP-SA-10001
- G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
- Screening performed to the document’s latest revision.
Environmental
Ambient temperature range:
–40°C to +85°C with (40°C rise) Irms current
Storage temperature range:
Component: –55°C to +125°C.
Tape and reel packaging: –55°C to +80°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+125°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
L vs Current vs Temperature
General specification
Core Material:
Ferrite
Weight:
2.4 g
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash