3D Model Datasheet
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Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±10%)
DCR (mΩ) 3 SRF typ (MHz) 4 Isat (A) 5 Irms (A) 6
typ max 10% drop 20% drop 30% drop 20°C rise 40°C rise
ST710PGP103KL 10 2.3 2.6 20 30.0 34.0 37.0 19 26
  1. When ordering, please specify screening code: e.g. ST710PGP333KLZ.
  2. Inductance tested at 300 kHz, 0.1 Vrms on Agilent/HP 4192A.
  3. DCR measured on a Keithley 580 micro-ohmmeter or equivalent.
  4. SRF measured on an Agilent/HP 4395A network analyzer and an Agilent/HP 16093B test fixture.
  5. DC current at 25°C that causes the specified inductance drop from its value without current.
  6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.


  • L = Tin-silver over copper


  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Coilcraft CP-SA-10001 Group A
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
    Screening performed to the document’s latest revision.
    Custom testing also available.
Ambient temperature range:
–40°C to +140°C with Irms current.
Storage temperature range:
Component: –55°C to +180°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+180°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Current

L vs Frequency

Physical characteristics



General specification

Core Material:
37 g
25 parts per tray


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.