3D Model Datasheet
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ST458RFW02B1

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Specifications

Electrical specifications at 25°C. Measurements are referenced to 50 Ohms.

Part number 1 L min per winding (µH) 2 DCR max (mΩ) 3 Imp. ratio
pri:sec 4
Current
rating (mA)
Insertion
loss (db)
DC imbalance 5 Bandwidth (MHz) Isolation
Voltage (Vrms)
Schematic
Pri Sec Pri Sec
ST458RFW02B1 10 20 120 150 1 : 2 250 0.5 8.5 0.2 500 300 B
Notes
  1. When ordering, please specify termination and testing codes: e.g. ST458RFW04C1LZ.
  2. Inductance measured at 100 kHz, 0.1 V, 0 Adc on an Agilent/HP 4192 or equivalent.
  3. DCR measured on a micro-ohmmeter.
  4. Impedance ratio is for the full primary winding to the full secondary winding.
  5. DC imbalance is the maximum difference in current measured at pins 4 and 6 with the source at pin 5. Inductance drop is 15% at maximum imbalance.

Termination:

  • L = Tin-silver-copper (95.5/4/0.5) over silver palladium-platinum-glass frit.
  • S = Tin-lead (63/37). (Special order,added cost)

Testing:

Z = Unscreened
H = Group A screening per Coilcraft CP-SA-10001
All screening performed to the document’s latest revision
Custom screening also available
Environmental
Ambient temperature range:
–40°C to +85°C
Storage temperature range:
Component: –55°C to +95°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+95°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Attenuation vs Frequency

Schematics

st458rfw_sch.PNG

Physical characteristics

st458rfw_dim.PNG

General specification

Core Material:
Ferrite
Packaging:
750/7′′ reel; Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 2.9 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.