Datasheet 3D Model
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Part number 1 Inductance (nH) 2
(Tolerance: ±5%)
Impedance typ (Ω) SRF min (MHz) 3 DCR max (Ω) 4 Imax (mA) 5
900 MHz 1.7 GHz
ST235RAR770JRZ 77 350 580 1740 0.072 590
  1. When ordering, please specify termination and screening codes: e.g. ST235RAR332JRZ.
  2. Inductance measured at 7.9 MHz using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286 impedance analyzer.
  3. SRF measured using Agilent/HP 8753D network analyzer and Coilcraft SMD -D test fixture.
  4. DCR measured on Cambridge Technology micro-ohmmeter and a Coilcraft CCF858 test fixture.
  5. Current that causes a 15°C temperature rise from 125°C ambient. Because of their open construction, these parts will not saturate.


  • R = RoHS compliant matte tin over nickel over silver-platinum-glass frit.
  • Q = RoHS tin-silver-copper (95.5/4/0.5). (Special order, added cost)
  • P = non-RoHS tin-lead (63/37). (Special order, added cost)


  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
    • Screening performed to the document’s latest revision.
    • Lot qualification (Group B) available.
    • Custom testing also available.
    • Country of origin restrictions available; prefix options G or F.
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –40°C to +80°C.
Maximum part temperature:
+140°C (Ambient + temperature rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Z vs Frequency

Z vs Frequency

Physical characteristics

A max B max C max D E F G H  
0.044 0.026 0.026 0.018 0.008 0.014 0.025 0.026 inches
1,11 0,66 0,66 0,46 0,20 0,36 0,635 0,66 mm

General specification

Core Material:
0.7 – 1.3 mg
2000 per 7′′ reel. Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +150 ppm/°C.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.
See Doc787_PCB_Washing.pdf.