Datasheet 3D Model
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ML413RAM152

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Specifications

Electrical specifications at 25°C.

Part number Inductance (µH) 1
(Tolerance: ±10%)
Q typ
@ 2.5 MHz 2
SRF min (MHz) 3 Isat (A) 4 DCR max (Ω) 5 Imax (A)
ML413RAM152KLZ 1.5 22 135 1.1 0.155 0.62
Notes
  1. Inductance measured at 2.5 MHz using Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer or equivalent with Coilcraftprovided correlation pieces.
  2. Q measured at 2.5 MHz using an Agilent/HP 4291A with an Agilent/HP 16197 test fixture or equivalents.
  3. SRF measured using an Agilent/HP 8753ES network analyzer or equivalent with a Coilcraft SMD-D fixture.
  4. DC current at which the inductance drops 10% (typ.) from its value without current.
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –65°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Current

L vs Frequency

Q vs Frequency

Physical characteristics

ml413ramd.gif

Dimensions are in  inchesmm

Terminal dimensions are without optional solder applied. For dimensions with optional solder, add 0.006 inches / 0,152 mm.
Visit Color Codes for RF Inductors for an explanation of the color dots.

General specification

Core Material:
Ferrite
Packaging:
2000 per 7″ reel Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 2.0 mm pocket depth.
Temperature coefficient of inductance:
+100 to +350 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.