3D Model
Datasheet
AR413RAB Series
Outgassing Compliant Chip Inductors
AR413RAB Series features low DCR and high current handling.
- Inductance values: 1.0 – 100 µH.
- Passes NASA low outgassing (Outgassing meets ASTM E595).
- High temperature materials allow operation in ambient temperatures up to 155°C.
- Tin-lead (Sn-Pb) terminations ensure the best possible board adhesion. Note: Nickel barrier termination (tin-lead over nickel over silver-platinum-glass frit, termination code P) is recommended for hand soldering applications.
- Tin-lead (63/37) over tin over nickel over silver-platinumglass frit terminations.
Specifications
Electrical specifications at 25°C.
Part not compliant with MIL-STD-981 Family 50, Class S due to wire gauge.
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±%) |
Q min 3 | SRF typ (MHz) 4 | DCR max (Ω) 5 | Imax (mA) |
|---|---|---|---|---|---|
| AR413RAB102JPZ | 1.0 @ 7.9 MHz | 16 @ 2.5 MHz | 230 | 0.62 | 370 |
| AR413RAB122JPZ | 1.2 @ 7.9 MHz | 18 @ 2.5 MHz | 210 | 0.68 | 370 |
| AR413RAB152JPZ | 1.5 @ 7.9 MHz | 20 @ 2.5 MHz | 190 | 0.76 | 370 |
| AR413RAB182JPZ | 1.8 @ 7.9 MHz | 20 @ 2.5 MHz | 170 | 0.84 | 370 |
| AR413RAB222JPZ | 2.2 @ 7.9 MHz | 22 @ 2.5 MHz | 150 | 1.1 | 310 |
| AR413RAB272JPZ | 2.7 @ 7.9 MHz | 20 @ 2.5 MHz | 135 | 1.3 | 270 |
| AR413RAB332JPZ | 3.3 @ 7.9 MHz | 20 @ 2.5 MHz | 120 | 1.5 | 260 |
| AR413RAB392JPZ | 3.9 @ 7.9 MHz | 22 @ 2.5 MHz | 105 | 1.6 | 250 |
| AR413RAB432JPZ | 4.3 @ 7.9 MHz | 24 @ 2.5 MHz | 85.0 | 1.7 | 230 |
| AR413RAB472JPZ | 4.7 @ 7.9 MHz | 24 @ 2.5 MHz | 90.0 | 1.7 | 230 |
| AR413RAB502JPZ | 5.0 @ 7.9 MHz | 23 @ 2.5 MHz | 30.0 | 2.2 | 200 |
| AR413RAB562JPZ | 5.6 @ 7.9 MHz | 23 @ 2.5 MHz | 80.0 | 1.8 | 220 |
| AR413RAB622JPZ | 6.2 @ 7.9 MHz | 24 @ 2.5 MHz | 75.0 | 2.5 | 195 |
| AR413RAB682JPZ | 6.8 @ 7.9 MHz | 24 @ 2.5 MHz | 70.0 | 2.0 | 210 |
| AR413RAB822JPZ | 8.2 @ 7.9 MHz | 23 @ 2.5 MHz | 65.0 | 2.7 | 190 |
| AR413RAB912JPZ | 9.1 @ 7.9 MHz | 25 @ 2.5 MHz | 57.0 | 2.9 | 170 |
| AR413RAB103JPZ | 10 @ 7.9 MHz | 24 @ 2.5 MHz | 60.0 | 3.0 | 165 |
| AR413RAB123JPZ | 12 @ 2.5 MHz | 28 @ 2.5 MHz | 38.0 | 3.3 | 160 |
| AR413RAB153JPZ | 15 @ 2.5 MHz | 28 @ 2.5 MHz | 30.0 | 3.7 | 150 |
| AR413RAB183JPZ | 18 @ 2.5 MHz | 28 @ 2.5 MHz | 26.0 | 4.0 | 140 |
| AR413RAB223JPZ | 22 @ 2.5 MHz | 28 @ 2.5 MHz | 22.0 | 6.1 | 115 |
| AR413RAB273JPZ | 27 @ 2.5 MHz | 28 @ 2.5 MHz | 12.0 | 6.5 | 110 |
| AR413RAB333JPZ | 33 @ 2.5 MHz | 30 @ 2.5 MHz | 19.0 | 7.0 | 110 |
| AR413RAB393JPZ | 39 @ 2.5 MHz | 29 @ 2.5 MHz | 26.0 | 10.0 | 90 |
| AR413RAB473JPZ | 47 @ 2.5 MHz | 30 @ 2.5 MHz | 12.0 | 10.7 | 80 |
| AR413RAB563JPZ | 56 @ 2.5 MHz | 20 @ 7.9 MHz | 8.0 | 10.0 | 95 |
| AR413RAB683JPZ | 68 @ 7.9 MHz | 17 @ 7.9 MHz | 5.7 | 13.5 | 85 |
| AR413RAB104JPZ | 100 @ 7.9 MHz | 18 @ 7.9 MHz | 4.5 | 20.5 | 65 |
Notes
- When ordering, please specify termination and screening codes: e.g. AR413RAB104JSZ.
- Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
- Q measured using an Agilent/HP 4291A with an Agilent/HP 16197 test fixture or equivalents.
- SRF measured using an Agilent/HP 8753ES network analyzer or equivalent with a Coilcraft CCF1502 fixture
- DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF1502 test fixture.
Termination:
- P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
- S = Tin-lead (63/37) over leach-resistant silverplatinum-glass frit.
- L = Silver-palladium-platinum-glass frit
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- 1 = EEE-INST-002 (Family 3) Level 1
- 2 = EEE-INST-002 (Family 3) Level 2
- 3 = EEE-INST-002 (Family 3) Level 3
- 4 = MIL-STD-981 (Family 50) Class B
- 5 = MIL-STD-981 (Family 50) Class S
- F = ESCC3201 (F4 operational life performed at 90°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
- Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
Physical characteristics
Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.
General specification
Core Material:
Ceramic/Ferrite
Weight:
35.0 – 51.0 mg
Packaging:
2000/7″ reel; Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 2.0 mm pocket depth
Temperature coefficient of inductance:
+25 to +125 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.