3D Model Datasheet

AR413RAB Series

Outgassing Compliant Chip Inductors

AR413RAB Series features low DCR and high current handling.
  • Inductance values: 1.0 – 100 µH.
  • Passes NASA low outgassing (Outgassing meets ASTM E595).
  • High temperature materials allow operation in ambient temperatures up to 155°C.
  • Tin-lead (Sn-Pb) terminations ensure the best possible board adhesion. Note: Nickel barrier termination (tin-lead over nickel over silver-platinum-glass frit, termination code P) is recommended for hand soldering applications.
  • Tin-lead (63/37) over tin over nickel over silver-platinumglass frit terminations.

Request Quote:
;

Specifications

Electrical specifications at 25°C.

Part not compliant with MIL-STD-981 Family 50, Class S due to wire gauge.

Part number 1 Inductance (µH) 2
(Tolerance: ±%)
Q min 3 SRF typ (MHz) 4 DCR max (Ω) 5 Imax (mA)
AR413RAB102JPZ 1.0 @ 7.9 MHz 16 @ 2.5 MHz 230 0.62 370
AR413RAB122JPZ 1.2 @ 7.9 MHz 18 @ 2.5 MHz 210 0.68 370
AR413RAB152JPZ 1.5 @ 7.9 MHz 20 @ 2.5 MHz 190 0.76 370
AR413RAB182JPZ 1.8 @ 7.9 MHz 20 @ 2.5 MHz 170 0.84 370
AR413RAB222JPZ 2.2 @ 7.9 MHz 22 @ 2.5 MHz 150 1.1 310
AR413RAB272JPZ 2.7 @ 7.9 MHz 20 @ 2.5 MHz 135 1.3 270
AR413RAB332JPZ 3.3 @ 7.9 MHz 20 @ 2.5 MHz 120 1.5 260
AR413RAB392JPZ 3.9 @ 7.9 MHz 22 @ 2.5 MHz 105 1.6 250
AR413RAB432JPZ 4.3 @ 7.9 MHz 24 @ 2.5 MHz 85.0 1.7 230
AR413RAB472JPZ 4.7 @ 7.9 MHz 24 @ 2.5 MHz 90.0 1.7 230
AR413RAB502JPZ 5.0 @ 7.9 MHz 23 @ 2.5 MHz 30.0 2.2 200
AR413RAB562JPZ 5.6 @ 7.9 MHz 23 @ 2.5 MHz 80.0 1.8 220
AR413RAB622JPZ 6.2 @ 7.9 MHz 24 @ 2.5 MHz 75.0 2.5 195
AR413RAB682JPZ 6.8 @ 7.9 MHz 24 @ 2.5 MHz 70.0 2.0 210
AR413RAB822JPZ 8.2 @ 7.9 MHz 23 @ 2.5 MHz 65.0 2.7 190
AR413RAB912JPZ 9.1 @ 7.9 MHz 25 @ 2.5 MHz 57.0 2.9 170
AR413RAB103JPZ 10 @ 7.9 MHz 24 @ 2.5 MHz 60.0 3.0 165
AR413RAB123JPZ 12 @ 2.5 MHz 28 @ 2.5 MHz 38.0 3.3 160
AR413RAB153JPZ 15 @ 2.5 MHz 28 @ 2.5 MHz 30.0 3.7 150
AR413RAB183JPZ 18 @ 2.5 MHz 28 @ 2.5 MHz 26.0 4.0 140
AR413RAB223JPZ6 22 @ 2.5 MHz 28 @ 2.5 MHz 22.0 6.1 115
AR413RAB273JPZ6 27 @ 2.5 MHz 28 @ 2.5 MHz 12.0 6.5 110
AR413RAB333JPZ6 33 @ 2.5 MHz 30 @ 2.5 MHz 19.0 7.0 110
AR413RAB393JPZ6 39 @ 2.5 MHz 29 @ 2.5 MHz 26.0 10.0 90
AR413RAB473JPZ6 47 @ 2.5 MHz 30 @ 2.5 MHz 12.0 10.7 80
AR413RAB563JPZ6 56 @ 2.5 MHz 20 @ 7.9 MHz 8.0 10.0 95
AR413RAB683JPZ6 68 @ 7.9 MHz 17 @ 7.9 MHz 5.7 13.5 85
AR413RAB104JPZ6 100 @ 7.9 MHz 18 @ 7.9 MHz 4.5 20.5 65
Notes
  1. When ordering, please specify termination and screening codes: e.g. AR413RAB104JSZ.
  2. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured using an Agilent/HP 4291A with an Agilent/HP 16197 test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer or equivalent with a Coilcraft CCF1502 fixture
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF1502 test fixture.

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • S = Tin-lead (63/37) over leach-resistant silverplatinum-glass frit.
  • L = Silver-palladium-platinum-glass frit

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Custom testing also available.
  • Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

ar413rab_dim.GIF
Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:
Ceramic/Ferrite
Weight:
35.0 – 51.0 mg
Packaging:
2000/7″ reel; Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 2.0 mm pocket depth
Temperature coefficient of inductance:
+25 to +125 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.