Close up of AE312RBA
Datasheet 3D Model

AE312RBA Series

Molded Chip Inductors

The AE312RBA Series is not recommended for new designs, but existing customers will continue to be supported. As an alternative, we recommend the AR312RAA Series which is a drop-in replacement with improved electrical performance due to lower DCR.
Our AE312RBA Series features exceptional Q and high SRFs, DCR and current carrying characteristics.
  • Outstanding self-resonant frequency.
  • Passes NASA low outgassing (Outgassing meets ASTM E595).
  • Fits standard 0603 footprint.
  • Gold over nickel terminations. (Tin-lead (63/37) and tin-silvercopper are also available.)

Specifications

Electrical specifications at 25°C.

Part is not compliant with MIL-STD-981 Family 50, Class S due to wire gauge.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%)
Q min 3 SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
AE312RBA2N2JAZ 2.2 @ 250 MHz 11.6 @ 250 MHz 5000 0.12 700
AE312RBA3N9JAZ 3.9 @ 250 MHz 16 @ 250 MHz 5000 0.096 700
AE312RBA6N8JAZ 6.8 @ 250 MHz 24.6 @ 250 MHz 5000 0.12 700
AE312RBA10NJAZ 10 @ 250 MHz 29 @ 250 MHz 5000 0.14 700
AE312RBA12NJAZ 12 @ 250 MHz 27 @ 250 MHz 3120 0.19 620
AE312RBA15NJAZ 15 @ 250 MHz 28 @ 250 MHz 2850 0.21 600
AE312RBA18NJAZ 18 @ 250 MHz 33 @ 250 MHz 2652 0.24 600
AE312RBA27NJAZ 27 @ 250 MHz 32 @ 250 MHz 2160 0.27 530
AE312RBA39NJAZ 39 @ 250 MHz 33 @ 250 MHz 2235 0.32 460
AE312RBA47NJAZ 47 @ 200 MHz 35 @ 200 MHz 2006 0.35 440
AE312RBA56NJAZ 56 @ 200 MHz 32 @ 200 MHz 1420 0.40 420
AE312RBA68NJAZ 68 @ 200 MHz 34 @ 200 MHz 1375 0.42 410
AE312RBA82NJAZ 82 @ 150 MHz 30 @ 150 MHz 1581 0.57 400
AE312RBAR12JAZ 120 @ 150 MHz 31.5 @ 150 MHz 1062 0.84 270
AE312RBAR15JAZ 150 @ 150 MHz 29 @ 150 MHz 1160 0.92 250
AE312RBAR20JAZ 200 @ 100 MHz 26 @ 100 MHz 1040 2.0 170
AE312RBAR22JAZ 220 @ 100 MHz 26 @ 100 MHz 1045 2.1 160
AE312RBAR27JAZ 270 @ 100 MHz 28 @ 100 MHz 867 2.2 150
AE312RBAR30JAZ 300 @ 100 MHz 23 @ 100 MHz 850 3.1 120
AE312RBAR39JAZ 390 @ 100 MHz 27 @ 100 MHz 748 4.1 100
Notes
  1. When ordering, specify termination and screening codes: e.g. AE312RBAR39JAZ.
  2. Inductance measured using a Coilcraft SMD-A test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
  3. Q measured at the same frequency as inductance using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.

Termination:

  • A = Gold over nickel over moly-mag.
  • C = Tin-lead (63/37) over gold over nickel over moly-mag.
  • F = Tin-silver-copper (95.5/4/0.5) over gold over nickel over moly-mag.

Screening:

  • Z = Unscreened
  • = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +155°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

ae312rba_dim.PNG

General specification

Core Material:
Ceramic
Weight:
3.5 – 8.0 mg
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +155 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.