Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) |
Q min
@ 150 MHz 3 |
SRF min (MHz) 4 | DCR max (mΩ) 5 | Imax (mA) |
|---|---|---|---|---|---|---|
| ST413RAD82N_LZ | 82 | 5,2,1 | 54 | 1060.00 | 160 | 800 |
Notes
- When ordering, specify tolerance, termination and testing codes: e.g. ST413RADR10GLZ.
- Inductance measured at 50 MHz using a Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
- Q measured using an Agilent/HP 4291A with an AgilentHP 16197A test fixture or equivalents.
- SRF measured using an Aglilent/HP 8753ES network analyzeror equivalent and a Coilcraft SMD-D test fixture.
- DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.
Tolerance:
- F = 1%
- G = 2%
- J = 5%
Termination:
- L = Silver-palladium-platinum glass frit.
- S = Tin-lead (63/37) over silver-platinum-glass frit. (Special order, added cost)
- T = Tin-silver-copper (95.5/4/0.5) over silver-platinumglass frit. (Special order, added cost)
Testing:
- Z = Unscreened
- H = Group A screening per Coilcraft CP-SA-10001
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +140°C
Tape and reel packaging: –55°C to +80°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+140°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
Q vs Frequency
General specification
Core Material:
Ceramic
Packaging:
2000/7″reel
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth.
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth.
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.