Datasheet 3D Model
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ST413RAD82N

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) Q min
@ 150 MHz 3
SRF min (MHz) 4 DCR max (mΩ) 5 Imax (mA)
ST413RAD82N_LZ 82 5,2,1 54 1060.00 160 800
Notes
  1. When ordering, specify tolerance, termination and testing codes: e.g. ST413RADR10GLZ.
  2. Inductance measured at 50 MHz using a Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured using an Agilent/HP 4291A with an AgilentHP 16197A test fixture or equivalents.
  4. SRF measured using an Aglilent/HP 8753ES network analyzeror equivalent and a Coilcraft SMD-D test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.

Tolerance:

  • F = 1%
  • G = 2%
  • J = 5%

Termination:

  • L = Silver-palladium-platinum glass frit.
  • S = Tin-lead (63/37) over silver-platinum-glass frit. (Special order, added cost)
  • T = Tin-silver-copper (95.5/4/0.5) over silver-platinumglass frit. (Special order, added cost)

Testing:

  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
All screening performed to the document’s latest revision.
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +140°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+140°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

Physical characteristics

st413rad_dim.PNG

General specification

Core Material:
Ceramic
Packaging:
2000/7″reel
Standard height parts: Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth.
Low profile parts: Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.