Close up of AR312RAAR27_PZ
Datasheet 3D Model
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AR312RAAR27

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) Q min
@ 100 MHz 3
SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
AR312RAAR27_PZ 270 5,2,1 26 700 2.300 150
Notes
  1. When ordering, please specify tolerance, termination and screening codes: e.g. AR312RAAR27JSZ.
  2. Inductance measured using a Coilcraft SMD-A test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
  3. Q measured at the same frequency as inductance using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.

Tolerance:

  • F = 1%
  • G = 2%
  • J = 5%

Termination:

For hand soldering applications, the nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended. Exposed gold or tin in the terminations migrates into the solder.
  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • C = Tin-lead (63/37) over gold over nickel over moly-mag.
  • S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
  • A = Gold over nickel over moly-mag.
  • L = Silver-palladium-platinum-glass frit.

Screening:

  • Z = Unscreened
  • = Coilcraft CP-SA-10001 Group A
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Physical characteristics

ar312raa_dim.PNG

General specification

Core Material:
Ceramic
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +155 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.