Datasheet 3D Model

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AR312RAA11N

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Specifications

Electrical specifications at 25°C.

Part number 1	Inductance (nH) 2	Tolerance (%)	900 MHz		1.7 GHz		Q min @ 250 MHz 3	SRF min (MHz) 4	DCR max (Ω) 5	Imax (mA)
Part number 1	Inductance (nH) 2	Tolerance (%)	L typ	Q typ 3	L typ	Q typ 3	Q min @ 250 MHz 3	SRF min (MHz) 4	DCR max (Ω) 5	Imax (mA)
AR312RAA11N_PZ	11	5,2,1	11	53	11.5	56	26	3640	0.130	700

Notes

When ordering, please specify tolerance, termination and screening codes: e.g. AR312RAAR27JSZ.
Inductance measured using a Coilcraft SMD-A test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
Q measured at the same frequency as inductance using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.

Tolerance:

F = 1%
G = 2%
J = 5%

Termination:

For hand soldering applications, the nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended. Exposed gold or tin in the terminations migrates into the solder.

P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
C = Tin-lead (63/37) over gold over nickel over moly-mag.
S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
A = Gold over nickel over moly-mag.
L = Silver-palladium-platinum-glass frit.

Screening:

Z = Unscreened
H = Coilcraft CP-SA-10001 Group A
F = ESCC3201 (F4 operational life performed at 90°C)
1 = EEE-INST-002 (Family 3) Level 1
2 = EEE-INST-002 (Family 3) Level 2
3 = EEE-INST-002 (Family 3) Level 3
4 = MIL-STD-981 (Family 50) Class B
5 = MIL-STD-981 (Family 50) Class S
Screening performed to the document’s latest revision.
Lot qualification (Group B) available.
Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
Country of origin restrictions available; prefix options G or F.

Environmental

Ambient temperature range:

–55°C to +125°C with Imax current.

Storage temperature range:

Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.

Maximum part temperature:

+155°C (ambient + temp rise).

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

See FIT/MTBF Calculations

Performance curves

Typical L vs Frequency

Physical characteristics

General specification

Core Material:

Ceramic

Packaging:

2000 per 7″ reel Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing.

Temperature coefficient of inductance:

+25 to +155 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity).

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.

Refer to Soldering Coilcraft Components before soldering.