Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) | 900 MHz | 1.7 GHz |
Q min
@ 250 MHz 3 |
SRF min (GHz) 4 | DCR max (Ω) 5 | Imax (mA) | ||
|---|---|---|---|---|---|---|---|---|---|---|
| L typ | Q typ 3 | L typ | Q typ 3 | |||||||
| AR235RAA12N_PZ | 12 | 5,2,1 | 11.9 | 53 | 12.7 | 71 | 24 | 3.60 | 0.120 | 580 |
Notes
- When ordering, specify tolerance, termination and screening codes: e.g. AR235RAA12NGPZ.
- Inductance measured at 250 MHz using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
- For Q min: Q measured at 250 MHz using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
For Q typ: Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents. - SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
- DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.
Tolerance:
- F = 1%
- G = 2%
- J = 5%
Termination:
For hand soldering applications, the nickel barrier termination (tin-lead over tin over nickel over silver-platinum glass frit, termination code P) is recommended. Exposed gold or tin in the terminations migrates into the solder.- P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
- C = Tin-lead (63/37) over gold over nickel over moly-mag.
- S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
- A = Gold over nickel over moly-mag.
- L = Silver-palladium-platinum-glass frit.
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Coilcraft CP-SA-10001 Group A
- G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
- 1 = EEE-INST-002 (Family 3) Level 1
- 2 = EEE-INST-002 (Family 3) Level 2
- 3 = EEE-INST-002 (Family 3) Level 3
- 4 = MIL-STD-981 (Family 50) Class B
- 5 = MIL-STD-981 (Family 50) Class S
- F = ESCC3201 (F4 operational life performed at 90°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
- Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +155°C.
Packaging: –55°C to +80°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
0.80 – 1.0 mg
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +155 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.