Datasheet
3D Model
Specifications
| Part number 1 |
Inductance (nH)
2
(Tolerance: ± 5%) |
900 MHz | 1.7 GHz | 2.4 GHz |
Q min
@ 250 MHz 3 |
SRF min (GHz) 4 | DCR max (Ω) 5 | Imax (mA) 6 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|
| L typ | Q typ 3 | L typ | Q typ 3 | L typ | Q typ 3 | ||||||
| ST220RAA21NJLZ | 21 | 20.9 | 53 | 22 | 82 | 24.1 | 95 | 21 | 4.0 | 0.370 | 320 |
Notes
- When ordering, please specify termination and screening codes: e.g. ST220RAA34NJLZ.
- Inductance measured at 250 MHz using a Coilcraft SMD-F fixture in an Agilent/HP 4286 impedance analyzer with Coilcraft-provided correlation pieces.
- For Q min: Q measured at 250 MHz using an Agilent/HP 4291A with an Agilent/ HP 16197A test fixture or equivalents.
For Q typ: Q measured using an Agilent/HP 4287A with an Agilent/HP 16193 test fixture. - SRF measured using an Agilent/HP 8722ES network analyzer and a test fixture with a 0.017″ air gap.
- DCR measured on a micro-ohmmeter and a Coilcraft CCF858 test fixture.
- Current that causes a 30°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Termination:
- R = Matte tin over nickel over silver-platinum glass frit.
- A = Gold over nickel over moly-mag.
- L = Silver-palladium-platinum glass frit.
- P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
- Q= Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.
- C = Tin-lead (63/37) over gold over nickel over moly-mag.
- F = Tin-silver-copper (95.5/4/0.5) over gold over nickel over moly-mag.
- S = Tin-lead (63/37) over silver-platinum-glass frit.
- T = Tin-silver-copper (95.5/4/0.5) over silver-platinum glass frit.
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
- Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
0.3 – 0.6 mg
Packaging:
2000 per 7″ reel. Paper tape: 8 mm wide, 0.5 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.