Datasheet 3D Model
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ST485PKA102

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±20%)
DCR max (mΩ) SRF typ (MHz) Isat (A) 3 Irms (A) 4
20°C rise 40°C rise
ST485PKA102MLZ 1.0 50.00 130 2.9 1.90 2.70
Notes
  1. Please specify tolerance, termination and screening codes: e.g. ST485PKA105MLZ.
  2. Tested at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP 4263B LCR meter or equivalent.
  3. DC current at 25°C that causes a 10% (typ) inductance drop from its value without current.
  4. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.

Tolerance:

  • K = 10%
  • M = 20%

Termination:

  • L = Gold over nickel over moly-manganese.
  • T = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
  • S = Tin-lead (63/37). (Special order, added cost)

Screening:

  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Group A screening per Coilcraft CPSA-10001
  • G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
All screening performed to the document’s latest revision.
Environmental
Ambient temperature range:
–40°C to +85°C with Irms current.
Storage temperature range:
Component: –55°C to +125°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+125°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical L vs Current

Physical characteristics

st485pka_dim.PNG

General specification

Core Material:
Ferrite
Weight:
128– 164 mg
Packaging:
750/7″ reel Plastic tape: 12 mm wide, 0.28 mm thick, 4 mm pocket spacing, 3 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.