Datasheet 3D Model
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AE563PKA124

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±20%)
DCR (mΩ) SRF (MHz) 3 Isat (mA) 4 Irms (mA) 5
typ max min typ 10% drop 20% drop 30% drop 20°C rise 40°C rise
AE563PKA124MSZ 120 384 452 8.3 10.0 700 850 980 680 900
Notes
  1. hen ordering, specify screening code: e.g. AE563PKA153MSZ.
  2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP 4263B LCR meter or equivalent.
  3. SRF measured using Agilent/HP 8753D network analyzer or equivalent.
  4. Typical DC current at which the inductance drops 10% (typ) from its value without current.
  5. Typical Current that causes a 40°C temperature rise from 25°C ambient.

Screening:

  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Coilcraft CP-SA-10001 Group A
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
  • 1/2/3 = EEE-INST-002 (Family 1) Level 1/2/3
  • 4/5 = MIL-STD-981 (Family 04) Class B=4, Class S=5
  • F = ESCC3201 (F4 operational life performed at 105°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Physical characteristics

ae563pka_dim.PNG

General specification

Core Material:
Ferrite
Weight:
0.95– 1.25 g
Packaging:
750 per 13″ reel Plastic tape: 24 mm wide, 0.35 mm thick, 12 mm pocket spacing, 6.4 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.