Datasheet 3D Model
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MS322PZA222

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±20%)
DCR (mΩ) 3 SRF (MHz) 4 Isat (A) 5 Irms (A) 6
typ max min typ 10% drop 20% drop 30% drop 20°C rise 40°C rise
MS322PZA222MSZ 2.2 278 306 88.0 110 0.49 0.69 0.78 0.71 0.95
Notes
  1. When ordering, please specify screening code: e.g. MS322PZA104MSZ.
  2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
  3. DCR measured on a micro-ohmmeter.
  4. SRF measured using Agilent/HP 4395A or equivalent.
  5. DC current at 25°C that causes the specified inductance drop from its value without current.
  6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.

Screening:

  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Group A screening per Coilcraft CP-SA-10001
  • G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
All screening performed to the document’s latest revision.
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical L vs Current

Physical characteristics

ms332pzad.gif

Note: Earlier production parts may not be marked with a dot.

Tape and Reel specification

ms322pza_tr.png

General specification

Core Material:
Composite
Weight:
9 – 13 mg
Packaging:
2000/7′′ reel Plastic tape: 8 mm wide, 0.28 mm thick, 4 mm pocket spacing, 0.76 mm pocket depth

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.