Datasheet 3D Models
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AE611PYA152

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±20%)
DCR (mΩ) 3 SRF (MHz) 4 Isat (A) 5 Irms (A) 6
typ max min typ 20°C rise 40°C rise
AE611PYA152MSZ 1.5 1.60 1.76 26 33 36.6 23.3 30.4
Notes
  1. When ordering, please specify screening code: e.g. AE611PYA153MSZ.
  2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
  3. DCR measured on a micro-ohmmeter.
  4. SRF measured using an Agilent/HP 4395A or equivalent.
  5. DC current at 25°C that causes an inductance drop of 30% (typ) from its value without current.
  6. Current that causes the specified temperature rise from 25°C ambient.
    This information is for reference only and does not represent absolute maximum ratings.

    Note:
    Irms testing was performed on a 0.060′′ thick pcb with 4 oz. copper traces optimized to minimize additional temperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.

Screening:

  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
All screening performed to the document’s latest revision.
Custom screening also available.
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

L vs Current

Physical characteristics

ae611pyad.gif

Dimensions are in  inchesmm

General specification

Core Material:
Composite
Weight:
5.2 – 7.0 g
Packaging:
300/13′′ reel Plastic tape: 24 mm wide, 0.4 mm thick, 16 mm pocket spacing, 10.21 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.