Datasheet 3D Model
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ST413PHA393

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±10%)
DCR max (Ω) 3 SRF typ (MHz) 4 Isat (mA) 5 Irms (mA) 6
10% drop 20% drop 30% drop 20°C rise 40°C rise
ST413PHA393KLZ 39 1.85 16 490 560 600 280 390
Notes
  1. When ordering, specify termination and screening codes: e.g. ST413PHA105KLZ.
  2. Inductance measured at 100 kHz, 0.1 Vrms, using Coilcraft SMD-A fixture in Agilent/HP 4263B impedance analyzer or equivalent.
  3. DCR measured on micro-ohmmeter and Coilcraft CCF858 test fixture.
  4. SRF measured using a Coilcraft CCF1297 test fixture and an Agilent/HP 8753D network analyzer or equivalent.
  5. DC current at 25°C that causes the specified inductance drop from its value without current.
  6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.

Termination:

  • L = Silver-palladium-platinum-glass frit.
  • T = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
  • S = Tin-lead (63/37). (Special order, added cost)

Screening:

  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Group A screening per Coilcraft CPSA-10001
  • G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
All screening performed to the document’s latest revision.
Environmental
Ambient temperature range:
–40°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +145°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+145°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

L vs Current

Physical characteristics

st413pha_dim.PNG

General specification

Core Material:
Ceramic/Ferrite
Weight:
116– 143 mg
Packaging:
750/7″ reel; 2500/13″ reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 3.3 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.