When ordering, specify conductors, termination and screening codes: e.g. ST515PMM101MLZ.
Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4263B LCR meter or equivalent.
DCR is measured on a micro-ohmmeter at points indicated in the diagram.
This information is for design purposes only and shall not be tested during screening.
DC current at 25°C that causes a 20% (typ) inductance drop from its value without current.
Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Termination:
L = Matte tin over nickel over copper.
T = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
S = Tin-lead (63/37). (Special order, added cost)
Screening:
Z = Unscreened
Y = Unscreened (SLDC Option A)
W = Unscreened (SLDC Option B)
H = Group A screening per Coilcraft CP-SA-10001
G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
All screening performed to the document’s latest revision.
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +85°C with (40°C rise) Irms current.
Storage temperature range:
Component: –55°C to +125°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+125°C (ambient + temp rise). Derating.
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Dimensions - Single Conductor
Dimensions - Dual Conductor
Notes:
1. Dimensions are in inches/mm.
2. Dimensions are before optional solder application. For maximum overall dimensions including solder, add 0.0025 in / 0.064 mm to the length, and 0.006 in / 0.15 mm to the height.
3. Top surface is divided by a slot which should be considered when handled by a vacuum pick-and-place process.
General specification
Core Material:
Ferrite
Weight:
0.44 - 0.47 g
Packaging:
500/7″ reel; Plastic tape: 16 mm wide, 0.33 mm thick, 12 mm pocket spacing, 3.12 mm pocket depth.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.