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ML566PNB153

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±20%)
DCR (mΩ) 3 SRF (MHz) 4 Isat (A) 5 Irms (A) 6
typ max min typ 10% drop 20% drop 30% drop 20°C rise 40°C rise
ML566PNB153MLZ 15 48.6 54.1 15.0 22.0 4.7 5.4 5.8 2.50 3.40
Notes
  1. When ordering, please specify screening code: ML566PNB105KLZ.
  2. Inductance measured at 100 kHz, 0.1 Vrms, 0 Adc using a Coilcraft SMD -A fixture in an Agilent/HP 4263B LCR meter or equivalent.
  3. DCR measured on a micro-ohmmeter and a Coilcraft CCF858 test fixture.
  4. SRF measured using an Agilent/HP 8753D network analyzer.
  5. DC current at which the inductance drops the specified amount from its value without current.
  6. Current that causes the specified temperature rise from 25°C ambient.

Screening:

  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Group A screening per Coilcraft CP-SA-10001
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
  • Screening performed to the document’s latest revision.
  • Custom testing also available.
  • Country of origin restrictions available; prefix option G.
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical L vs Current

Physical characteristics

ml566pnb_dim.png

General specification

Core Material:
Ferrite
Weight:
2.3 g – 2.5 g
Packaging:
200/7′′ reel Plastic tape: 24 mm wide, 0.35 mm thick, 16 mm pocket spacing, 4.7mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.