Datasheet
3D Model
Specifications
Electrical specifications at 25°C. Measurements are referenced to 50 Ohms.
| Part number 1 | L min per winding (µH) 2 | DCR max (mΩ) 3 |
Imp. ratio pri:sec 4 |
Current rating (mA) |
Insertion loss (db) |
DC imbalance 5 | Bandwidth (MHz) |
Isolation Voltage (Vrms) |
Schematic | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Pri | Sec | Pri | Sec | ||||||||
| AR458RFW04B1 | 1.2 | 4.8 | 46.0 | 62.0 | 1 : 4 | 250 | 1.8 | 30.0 | 3 — 1100 | 300 | B |
Notes
- When ordering, please specify screening code: e.g. AR458RFW04C1SZ.
- Inductance measured at 100 kHz, 0.1 V, 0 Adc on an Agilent/HP 4192 or equivalent.
- DCR measured on a micro-ohmmeter.
- Impedance ratio is for the full primary winding to the full secondary winding.
- DC imbalance is the maximum difference in current measured at pins 4 and 6 with the source at pin 5. Inductance drop is 15% at maximum imbalance.
Screening:
Z = UnscreenedH = Group A screening per Coilcraft CP-SA-10001
2 = EEE-INST-002 level 2
3 = EEE-INST-002 level 3
4 = MIL-STD-981 Class B
5 = MIL-STD-981 Class S
F = Screening per ESCC 3201
All screening performed to the document’s latest revision Custom screening also available
Note: Screening T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary.
Environmental
Ambient temperature range:
-55°C to +155°C
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Attenuation vs Frequency
Schematics
General specification
Core Material:
Ferrite
Packaging:
750/7′′ reel; Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 2.9 mm pocket depth
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.