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AR312RAM561

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ±5%)
Impedance typ (Ω)
@ 100 MHz
Q min
@ 7.9 MHz 3
SRF min (MHz) 4 DCR max (Ω) 5 Imax (A)
AR312RAM561JPZ 560 371 12 400 0.490 0.42
Notes
  1. When ordering, please specify screening code: e.g. AR312RAM103JPZ.
  2. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured at the same frequency as inductance using an Agilent/ HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft SMD-D test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF1010 test fixture.

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Custom testing also available.
  • Country of origin restrictions available; prefix option G.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

Impedance vs Frequency

Physical characteristics

st312ramd.gif
 
A max B max C max D ref E F G H I J  
0.071 0.044 0.036 0.015 0.030 0.013 0.034 0.040 0.025 0.025 inches
1,80 1,12 0,91 0,38 0,76 0,33 0,86 1,02 0,64 0,64 mm
Note: Dimensions are before optional solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:
Ferrite
Weight:
4.3 – 5.7 mg
Packaging:
2000 per 7′′ reel; Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+50 to +300 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.