3D Model
Datasheet
AR235RAR
Outgassing Compliant Chip Inductors
AR235RAR Series features low DCR and high current handling.
- Inductance values: 20 nH – 3.3 µH.
- Ferrite construction for high current handling
- Passes NASA low outgassing specifications
- High temperature materials allow operation in ambient temperatures up to 140°C.
- Standard tin-lead (Sn-Pb) terminations ensure the best possible board adhesion. Note: Nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended for hand soldering applications.
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (nH)
2
(Tolerance: ±5%) |
Impedance typ (Ω) | SRF min (MHz) 3 | DCR max (Ω) 4 | Imax (mA) | |
|---|---|---|---|---|---|---|
| 900 MHz | 1.7 GHz | |||||
| AR235RAR200JPZ | 20 | 90.0 | 150 | 2500 | 0.049 | 700 |
| AR235RAR360JPZ | 36 | 150 | 250 | 2040 | 0.055 | 700 |
| AR235RAR560JPZ | 56 | 250 | 480 | 1870 | 0.061 | 650 |
| AR235RAR770JPZ | 77 | 350 | 580 | 1740 | 0.072 | 590 |
| AR235RAR900JPZ | 90 | 400 | 600 | 1950 | 0.079 | 490 |
| AR235RAR101JPZ | 105 | 530 | 1000 | 1410 | 0.10 | 490 |
| AR235RAR121JPZ | 120 | 515 | 900 | 1700 | 0.090 | 520 |
| AR235RAR141JPZ | 140 | 650 | 1075 | 1230 | 0.14 | 420 |
| AR235RAR151JPZ | 150 | 700 | 1170 | 1530 | 0.13 | 440 |
| AR235RAR181JPZ | 180 | 850 | 1460 | 1430 | 0.17 | 380 |
| AR235RAR221JPZ | 220 | 1100 | 2050 | 1320 | 0.24 | 320 |
| AR235RAR271JPZ | 270 | 1300 | 2150 | 1260 | 0.27 | 310 |
| AR235RAR301JPZ | 300 | 1725 | 2630 | 1190 | 0.34 | 270 |
| AR235RAR331JPZ | 330 | 2100 | 2750 | 1140 | 0.44 | 240 |
| AR235RAR361JPZ | 360 | 2150 | 3100 | 1020 | 0.48 | 230 |
| AR235RAR421JPZ | 420 | 2175 | 3350 | 935 | 0.51 | 220 |
| AR235RAR471JPZ | 470 | 2550 | 3670 | 910 | 0.67 | 190 |
| AR235RAR531JPZ | 530 | 3950 | 3050 | 850 | 0.72 | 190 |
| AR235RAR591JPZ | 590 | 4770 | 3090 | 810 | 0.78 | 180 |
| AR235RAR102JPZ | 1000 | 280 | 180 | 200 | 1.1 | 150 |
| AR235RAR222JPZ | 2200 | 200 | 120 | 105 | 1.8 | 120 |
| AR235RAR332JPZ | 3300 | 160 | 80.0 | 68 | 2.2 | 110 |
Notes
- When ordering, please specify screening code: e.g. AR235RAB332JPZ.
- Inductance measured at 7.9 MHz using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286 impedance analyzer.
- SRF measured using Agilent/HP 8753D network analyzer and Coilcraft CCF1232 test fixture.
- DCR measured on Cambridge Technology micro-ohmmeter and a Coilcraft CCF1010 test fixture.
Termination:
Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- 1 = EEE-INST-002 (Family 3) Level 1
- 2 = EEE-INST-002 (Family 3) Level 2
- 3 = EEE-INST-002 (Family 3) Level 3
- 4 = MIL-STD-981 (Family 50) Class B
- 5 = MIL-STD-981 (Family 50) Class S
- F = ESCC3201 (F4 operational life performed at 90°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
- Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +140°C
Tape and reel packaging: –40°C to +80°C
Tape and reel packaging: –40°C to +80°C
Maximum part temperature:
+140°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Z vs Frequency
Typical Z vs Frequency
Physical characteristics
|
A |
B max |
C max |
D ref |
E ref |
F ref |
G ref |
H ref |
I ref |
|
|---|---|---|---|---|---|---|---|---|---|
| 0.044 | 0.031 | 0.026 | 0.010 | 0.018 | 0.008 | 0.026 | 0.014 | 0.025 | inches |
| 1,11 | 0,79 | 0,66 | 0,25 | 0,46 | 0,20 | 0,66 | 0,36 | 0,64 | mm |
General specification
Core Material:
Ferrite
Weight:
0.7 – 1.3 mg
Packaging:
2000 per 7″ reel. Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing
Temperature coefficient of inductance:
+25 to +125 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.