Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (µH) 2 | Tolerance (%) |
Q min
@ 50.0 MHz 3 |
SRF min (MHz) 4 | DCR max (Ω) 5 | Imax (mA) |
|---|---|---|---|---|---|---|
| MS450RAA272JSZ | 2.7 | 5,2 | 53 | 160 | 3.2 | 200 |
Notes
- When ordering, please specify tolerance and termination codes: e.g. MS450RAA333JSZ.
- Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286 impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
- Q measured at the same frequency as inductance using an Agilent/ HP 4291A with an Agilent/HP 16193 test fixture or equivalents.
- SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft SMD-D test fixture.
- DCR measured on a micro-ohmmeter.
Tolerance:
- G= 2%
- J = 5%
Termination:
- S = Tin-lead (63/37) over silver-platinum-glass frit.
- T = Tin-silver-copper (95.5/4/0.5) over silver-platinumglass frit. (Special order, added cost)
- P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit. (Special order, added cost)
- Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit. (Special order, added cost)
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
102 – 142 mg
Packaging:
600 per 7″ reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 3.7 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.