Datasheet 3D Model
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ST336RAG33N

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) 3 Q typ
@ 500 MHz 4
SRF typ (MHz) 5 DCR max (mΩ) 6 Imax (mA) 7
ST336RAG33N_R_ 33 5,2 100 2410 87.000 800
Notes
  1. When ordering, specify tolerance, termination and testing codes: e.g. ST336RAG821JRZ.
  2. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer with Coilcraft-provided correlation pieces.
  3. Tolerances in bold are stocked for immediate shipment.
  4. Q measured using an Agilent/HP 4291A with an Agilent/HP 16193 test fixture.
  5. SRF measured using an Agilent/HP 8720D network analyzer and a Coilcraft SMD -D test fixture.
  6. DCR measured on a Cambridge Technology micro-ohmmeter and a Coilcraft CCF858 test fixture.
  7. Current that causes a 15°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.

Tolerance:

  • G = 2%
  • J = 5%

Termination:

  • R = Matte tin over nickel over silver-platinum-glass frit.
  • Q = Tin-silver-copper (95.5/4/0.5) over tin. (Special order, added cost)
  • P = non-RoHS tin-lead (63/37) over tin. (Special order, added cost)

Testing:

  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
All screening performed to the document’s latest revision.
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current
Storage temperature range:
Component: –55°C to +140°C
Tape and reel packaging: –40°C to +80°C
Maximum part temperature:
+140°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

Physical characteristics

st336rag_dim.PNG

General specification

Core Material:
Ceramic
Weight:
9.5 – 12.5 mg
Packaging:
2000/7″ reel; 7500/13″ reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth.
Temperature coefficient of inductance:
+100 to +250 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.