Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) 3 |
Q typ
@ 500 MHz 4 |
SRF typ (MHz) 5 | DCR max (mΩ) 6 | Imax (mA) 7 |
|---|---|---|---|---|---|---|
| ST336RAG11N_R_ | 11 | 5,2 | 93 | 4750 | 39.000 | 800 |
Notes
- When ordering, specify tolerance, termination and testing codes: e.g. ST336RAG821JRZ.
- Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286A impedance analyzer with Coilcraft-provided correlation pieces.
- Tolerances in bold are stocked for immediate shipment.
- Q measured using an Agilent/HP 4291A with an Agilent/HP 16193 test fixture.
- SRF measured using an Agilent/HP 8720D network analyzer and a Coilcraft SMD -D test fixture.
- DCR measured on a Cambridge Technology micro-ohmmeter and a Coilcraft CCF858 test fixture.
- Current that causes a 15°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Tolerance:
- G = 2%
- J = 5%
Termination:
- R = Matte tin over nickel over silver-platinum-glass frit.
- Q = Tin-silver-copper (95.5/4/0.5) over tin. (Special order, added cost)
- P = non-RoHS tin-lead (63/37) over tin. (Special order, added cost)
Testing:
- Z = Unscreened
- H = Group A screening per Coilcraft CP-SA-10001
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current
Storage temperature range:
Component: –55°C to +140°C
Tape and reel packaging: –40°C to +80°C
Tape and reel packaging: –40°C to +80°C
Maximum part temperature:
+140°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
9.5 – 12.5 mg
Packaging:
2000/7″ reel; 7500/13″ reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth.
Temperature coefficient of inductance:
+100 to +250 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.