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View:
Introduction
Specifications
Environmental
Performance curves
Physical characteristics
Soldering/Washing
Products
RF
Ceramic Core Chip Inductors
ST336RAD
ST336RAD39N
Back to
ST336RAD
ST336RAD39N
Datasheet
3D Model
Request Quote:
;
ST336RAD39N
For more information and specification about the part.
Go to series
Specifications
Electrical specifications at 25°C.
Part number
1
Inductance (nH)
2
Tolerance (%)
Q min
@ 250 MHz
3
SRF min (GHz)
4
DCR max (Ω)
5
Imax (A)
ST336RAD39N_LZ
39
5,2,1
53
1.60
0.110
1.0
Notes
When ordering, specify
tolerance
,
termination
and
testing
codes: e.g. ST336RAD51N
GLZ
.
Inductance measured using a Coilcraft SMD-A fixture in an Agilent/HP 4286 impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
Q measured at the same frequency as inductance using an Agilent/HP 4291A with an Agilent/HP 16197 test fixture or equivalents.
SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft SMD-D test fixture.
DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF858 test fixture.
Tolerance:
F
= 1%
G
= 2%
J
= 5%
Termination:
L
= Silver-palladium-platinum glass frit.
S
= Tin-lead (63/37) over silver-platinum-glass frit.
(Special order, added cost)
T
= Tin-silver-copper (95.5/4/0.5) over silver-platinum-glass frit.
(Special order, added cost)
Testing:
Z
= Unscreened
H
= Group A screening per Coilcraft CP-SA-10001
All screening performed to the document’s latest revision.
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +140°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
See FIT/MTBF Calculations
Performance curves
Typical Q vs Frequency
Typical L vs Frequency
Physical characteristics
General specification
Core Material:
Ceramic
Packaging:
2000 per 7′′ reel Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to
Soldering Coilcraft Components
before soldering.
Warning
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