Close up of ST312RAG3N3_LZ
Datasheet 3D Model
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ST312RAG3N3

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) 900 MHz 1.7 GHz Q min
@ 250 MHz 3
SRF min (GHz) 4 DCR max (Ω) 5 Imax (mA) Color code
L typ Q typ 3 L typ Q typ 3
ST312RAG3N3_LZ 3.3 5,2 3.28 67 3.32 104 35 > 5.00 0.030 800 Blue
Notes
  1. When ordering, specify tolerance, termination and testing codes: e.g. ST312RAGR39GLZ.
  2. Inductance measured using a Coilcraft SMD-A test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
  3. Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft CCF1232 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF1010 test fixture.

Tolerance:

  • G = 2%
  • J = 5%

Termination:

  • L = Silver-palladium-platinum-glass frit.
  • S = Tin-lead (63/37) over silver-palladium-platinum-glass frit. (Special order, added cost)
  • T = Tin-silver-copper (95.5/4/0.5) over silver-palladium-platinum-glass frit. (Special order, added cost)

Testing:

  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
All screening performed to the document’s latest revision.
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

DIM.PNG

General specification

Core Material:
Ceramic
Packaging:
2000 per 7′′ reel Paper tape: 8 mm wide, 1 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.