Datasheet 3D Model
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CP312RAQ33N

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2 Tolerance (%) 3 900 MHz 1.7 GHz Q min
@ 250 MHz 4
SRF min (MHz) 5 DCR max (mΩ) 6 Imax (mA) 7
Q typ 4 Q typ 4
CP312RAQ33N_RZ 33 5,3,2 74 53 40 1900.00 124.000 700
Notes
  1. When ordering, please specify tolerance, termination and screening codes: e.g. CP312RAQR47JRZ.
  2. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP E4982A impedance analyzer with Coilcraft-provided correlation pieces.
  3. Tolerances in bold are stocked for immediate shipment.
  4. Q measured using an Agilent/HP4991A with an Agilent/HP16197 test fixture.
  5. SRF measured using an Agilent/HP 5071C/8722ES network analyzer and a Coilcraft CCF1052 test fixture.
  6. DCR measured on a micro-ohmmeter and a Coilcraft CCF1010/A test fixture.
  7. Maximum current that can be applied at 125°C.

Tolerance:

  • G = 2%
  • H = 3%
  • J = 5%
Table shows stock values and tolerances in bold.

Termination:

  • R = Matte tin over nickel over silver-platinum glass frit
  • P = Tin-lead (63/37) over tin over nickel over silver platinum-glass frit
  • Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • Screening performed to the document’s latest revision.
  • Custom testing also available.
  • Country of origin restrictions available; prefix option G.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

cp312raq_dim.PNG
A max B max C max D E F G H  
0.067 0.039 0.035 0.028 0.013 0.033 0.016 0.051 inches
1,70 0,99 0,89 0,71 0,33 0,85 0,40 1,29 mm

Notes: Dimensions are before optional solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C.

General specification

Core Material:
Ceramic
Weight:
3 – 4 mg
Packaging:
2000 per 7” reel; Paper tape: 8 mm wide, 0.95 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.