Close up of AR312RAP
Datasheet 3D Model

AR312RAP Series

Chip Inductors for Critical Applications

Our AR312RAP Series offers 14 inductance values from 240 nH – 2.7 µH.
  • Higher inductance values than other 0603 ceramic chip inductors.
  • Tin-lead (63/37) over tin over nickel over silver-platinum glass frit terminations. Other terminations available at an additional cost.

Looking for the commercial version of this part? See Coilcraft 0603HL Series
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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%)
Q @ 25.0 MHz 3 SRF (MHz) 4 DCR max (Ω) 5 Irms (mA) 6
min typ min typ
AR312RAP241JPZ 240 20 16 450 360 1.00 250
AR312RAP251JPZ 250 19 15 420 340 1.05 240
AR312RAP301JPZ 300 19 15 410 330 1.15 230
AR312RAP311JPZ 310 20 16 420 330 1.15 230
AR312RAP331JPZ 330 10 13 330 420 0.97 330
AR312RAP341JPZ 340 15 12 435 350 1.45 200
AR312RAP361JPZ 360 16 12 355 285 1.50 190
AR312RAP391JPZ 390 10 13 320 400 1.05 330
AR312RAP471JPZ 470 9 12 160 200 1.15 300
AR312RAP511JPZ 510 9 12 270 340 1.20 300
AR312RAP561JPZ 560 9 12 260 330 1.35 300
AR312RAP681JPZ 680 9 12 240 310 1.80 260
AR312RAP821JPZ 820 11 14 230 290 2.45 190
AR312RAP102JPZ 1000 11 14 200 250 2.80 190
AR312RAP122JPZ 1200 11 14 180 230 3.20 180
AR312RAP152JPZ 1500 12 15 150 190 4.10 150
AR312RAP182JPZ 1800 12 16 140 180 5.30 140
AR312RAP222JPZ 2200 12 16 130 165 5.90 130
AR312RAP272JPZ 2700 12 16 120 150 7.00 120
Notes
  1. When ordering, please specify termination and screening codes: e.g. AR312RAP272JPZ.
  2. Inductance measured at 0.1 Vrms, using a Coilcraft SMD-A fixture in Agilent/HP 4287A impedance analyzer or equivalent with Coilcraftprovided correlation pieces.
  3. Q measured at using an Agilent/HP 16197A fixture in Agilent/HP 4291 impedance analyzer or equivalents.
  4. SRF measured using Agilent/HP 8753D network analyzer or equivalent with a Coilcraft CCF1232 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF1010 test fixture.
  6. Current that causes a 15°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Parts are not compliant with MIL-STD-981 Family 50, Class S due to wire gauge.

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • C = Tin-lead (63/37) over gold over nickel over moly-mag.
  • S = Tin-lead (63/37) over leach-resistant silver-platinumglass frit.
  • A = Gold over nickel over moly-mag.
  • L = Silver-palladium-platinum-glass frit.

Screening:

  • Z = Unscreened
  • = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–65°C to +125°C with Imax current.
Storage temperature range:
Component: –65°C to +155°C.
Tape & reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical Impedance vs Frequency

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

ar312rap_dim.PNG

General specification

Core Material:
Ceramic
Weight:
3.2 – 4.4 mg
Packaging:
2000 per 7″ reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.0 mm pocket depth.
Temperature coefficient of inductance:
+50 to +150 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.