Datasheet 3D Model
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Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) 3 900 MHz Q min
@ 250 MHz 4
SRF min (MHz) 5 DCR max (mΩ) 6 Imax at 125°C (mA) 7
Q typ 4
ST235RAQ91N_RZ 91.0 5,3,2 48 26 2300 1119 190
  1. When ordering, please specify tolerance, termination and testing codes: e.g. ST235RAQ5N9JRZ.
  2. Inductance measured at 250 MHz using a Coilcraft SMD-F fixture in an Agilent/HP 4287 impedance analyzer with Coilcraft-provided correlation pieces.
  3. Tolerances in bold are stocked for immediate shipment.
  4. Q measured using an Agilent/HP 4991A with an Agilent/HP 16197 test fixture.
  5. SRF measured using an Agilent/HP 8722ES network analyzer and a Coilcraft SMD-D test fixture.
  6. DCR measured on a micro-ohmmeter and a Coilcraft CCF858 test fixture.
  7. Maximum current that can be applied at 125°C.


  • G = 2%
  • H = 3%
  • J = 5%
Table shows stock values and tolerances in bold.


  • R = Matte tin over nickel over silver-platinum glass frit
  • P = Tin-lead (63/37) over tin over nickel over silver platinum-glass frit
  • Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit


  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
All screening performed to the document’s latest revision.
Custom screening also available.
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –40°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics


General specification

Core Material:
0.7 – 1.0 mg
2000 or 10,000 per 7″ reel; Paper tape: 8 mm wide, 0.66 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.
See Doc787_PCB_Washing.pdf.