Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (nH)
2
(Tolerance: ± 5%) |
Q min
@ 25.0 MHz 3 |
SRF min (MHz) 4 | DCR max (Ω) 5 | Imax (mA) |
|---|---|---|---|---|---|
| ST235RAP471JRZ | 470 | 8 | 176 | 2.67 | 160 |
Notes
- When ordering, please specify termination and testing codes: e.g. ST235RAP821JRZ.
- Inductance measured at 25 MHz using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286 impedance analyzer.
- Q measured using a Coilcraft SMD-F fixture in Agilent/HP 4287A impedance analyzer or equivalent.
- SRF measured using Agilent/HP 8753D network analyzer and Coilcraft SMD -D test fixture.
- DCR measured on Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.
Termination:
- R = Matte tin over nickel over silver-platinum-glass frit.
- Q = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
- P = Tin-lead (63/37). (Special order, added cost)
Testing:
- Z = Unscreened
- H = Group A screening per Coilcraft CP-SA-10001
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical Impedance vs Frequency
Typical L vs Frequency
Typical Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
0.7 – 1.3 mg
Packaging:
2000 per 7″ reel. Paper tape: 8 mm wide, 0.66 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +150 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.