Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) | 900 MHz | 1.7 GHz |
Q min
@ 250 MHz 3 |
SRF min (GHz) 4 | DCR max (Ω) 5 | Imax (mA) | ||
|---|---|---|---|---|---|---|---|---|---|---|
| L typ | Q typ 3 | L typ | Q typ 3 | |||||||
| ST235RAA5N1_LZ | 5.1 | 5,2,1 | 5.15 | 56 | 5.25 | 82 | 20 | 4.80 | 0.083 | 600 |
Notes
- When ordering, specify tolerance, termination and screening codes: e.g. ST235RAA12NGRZ.
- Inductance measured at 250 MHz using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
- For Q min: Q measured at 250 MHz using an Agilent/HP 4291A with an Agilent/ HP 16197A test fixture or equivalents.
For Q typ: Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents. - SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
- DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.
Tolerance:
- F = 1%
- G = 2%
- J = 5%
Termination:
- R = Matte tin over nickel over silver-platinum glass frit.
- A = Gold over nickel over moly-mag.
- L = Silver-palladium-platinum glass frit.
- P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.
- Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.
- C = Tin-lead (63/37) over gold over nickel over moly-mag.
- F = Tin-silver-copper (95.5/4/0.5) over gold over nickel over moly-mag.
- S = Tin-lead (63/37) over silver-platinum-glass frit.
- T = Tin-silver-copper (95.5/4/0.5) over silver-platinum glass frit.
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
- Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
0.80 – 1.0 mg
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +155 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.