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CP235RAK9N5

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2 Tolerance (%) 3 900 MHz 1.7 GHz 2.4 GHz Q min
@ 250 MHz 4
SRF min (GHz) 5 DCR max (mΩ) 6 Imax (mA)
Q typ 4 Q typ 4 Q typ 4
CP235RAK9N5_RZ 9.5 5,3,2 47 64 77 20 5.0 100 680
Notes
  1. When ordering, specify tolerance, termination, and screening codes: e.g. CP235RAK56NJRZ.
  2. Inductance measured at 250 MHz, 0.1 Vrms, 0 Adc using Coilcraft SMD-A fixture in Agilent/HP 4287A impedance analyzer.
  3. Tolerances in bold are stocked for immediate shipment.
  4. Q is measured using Agilent/HP4991A with Agilent/HP 16197 test fixture.
  5. SRF is measured on an Agilent 8753ES (or equivalent) with a Coilcraft CCF1232 test fixture.
  6. DCR is measured on a Keithly 580 micro-ohmmeter (or equivalent) with a Coilcraft CCF1010 test fixture.

Tolerance:

  • G = 2%
  • H = 3%
  • J = 5%

Termination:

  • R = Matte tin over nickel over silver-platinum-glass frit.
  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.

Screening:

  • Z = Unscreened
  • = Coilcraft CP-SA-10001 Group A
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

cp235rak_dim.PNG

General specification

Core Material:
Ceramic
Weight:
0.6 – 0.8 mg
Packaging:
2000/7″reel; Paper tape: 8 mm wide, 0.6 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.
See Doc787_PCB_Washing.pdf.