Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) 3 | 900 MHz | 1.7 GHz |
Q min
@ 250 MHz 4 |
SRF min (GHz) 5 | DCR max (mΩ) 6 | Imax (mA) |
|---|---|---|---|---|---|---|---|---|
| Q typ 4 | Q typ 4 | |||||||
| CP235RAK56N_RZ | 56 | 5,3,2 | 45 | 53 | 20 | 3.1 | 1250 | 140 |
Notes
- When ordering, specify tolerance, termination, and screening codes: e.g. CP235RAK56NJRZ.
- Inductance measured at 250 MHz, 0.1 Vrms, 0 Adc using Coilcraft SMD-A fixture in Agilent/HP 4287A impedance analyzer.
- Tolerances in bold are stocked for immediate shipment.
- Q is measured using Agilent/HP4991A with Agilent/HP 16197 test fixture.
- SRF is measured on an Agilent 8753ES (or equivalent) with a Coilcraft CCF1232 test fixture.
- DCR is measured on a Keithly 580 micro-ohmmeter (or equivalent) with a Coilcraft CCF1010 test fixture.
Tolerance:
- G = 2%
- H = 3%
- J = 5%
Termination:
- R = Matte tin over nickel over silver-platinum-glass frit.
- P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
- Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
- Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–40°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
0.6 – 0.8 mg
Packaging:
2000/7″reel; Paper tape: 8 mm wide, 0.6 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.
See Doc787_PCB_Washing.pdf.
See Doc787_PCB_Washing.pdf.