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3D Model Datasheet

AR235RAP Series

Chip Inductors for Critical Applications

AR235RAP Series chip inductors feature higher inductance values than other 0402 ceramic chip inductors.
  • Exceptionally high Q factors
  • Outstanding self-resonant frequency
  • Tight inductance tolerance
  • High temperature materials allow operation in ambient temperatures up to 155°C.
  • Passes NASA low outgassing specifications
  • Standard tin-lead (Sn‑Pb) terminations ensures the best possible board adhesion. Note: Nickel barrier termination (tin-lead over tin over nickel over silver-platinum-glass frit, termination code P) is recommended for hand soldering applications.

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%) 		Q min 3 SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
AR235RAP430JPZ 43 @ 250 MHz 21 @ 250 MHz 2900 0.75 250
AR235RAP510JPZ 51 @ 250 MHz 21 @ 250 MHz 2700 0.85 240
AR235RAP560JPZ 56 @ 250 MHz 21 @ 250 MHz 2600 0.90 240
AR235RAP680JPZ 68 @ 250 MHz 11 @ 100 MHz 760 0.85 230
AR235RAP720JPZ 72 @ 250 MHz 12 @ 100 MHz 720 0.90 210
AR235RAP750JPZ 75 @ 250 MHz 11 @ 100 MHz 700 0.90 210
AR235RAP820JPZ 82 @ 250 MHz 11 @ 100 MHz 680 0.95 210
AR235RAP900JPZ 90 @ 250 MHz 11 @ 100 MHz 560 1.00 210
AR235RAP910JPZ 91 @ 250 MHz 10 @ 100 MHz 560 1.00 200
AR235RAP101JPZ 100 @ 250 MHz 10 @ 100 MHz 680 1.05 200
AR235RAP111JPZ 110 @ 250 MHz 10 @ 100 MHz 670 1.10 190
AR235RAP121JPZ 120 @ 250 MHz 11 @ 100 MHz 530 1.15 190
AR235RAP151JPZ 150 @ 100 MHz 10 @ 100 MHz 640 1.35 180
AR235RAP181JPZ 180 @ 100 MHz 9 @ 100 MHz 510 1.45 170
AR235RAP201JPZ 200 @ 100 MHz 9 @ 100 MHz 510 1.55 170
AR235RAP221JPZ 220 @ 100 MHz 9 @ 100 MHz 540 1.70 170
AR235RAP271JPZ 270 @ 25.0 MHz 8 @ 25.0 MHz 470 1.95 160
AR235RAP301JPZ 300 @ 25.0 MHz 8 @ 25.0 MHz 480 2.15 160
AR235RAP331JPZ 330 @ 25.0 MHz 8 @ 25.0 MHz 410 2.23 150
AR235RAP361JPZ 360 @ 25.0 MHz 8 @ 25.0 MHz 388 2.36 140
AR235RAP391JPZ 390 @ 25.0 MHz 8 @ 25.0 MHz 208 2.35 140
AR235RAP471JPZ 470 @ 25.0 MHz 8 @ 25.0 MHz 176 2.67 130
Notes
  1. When ordering, please specify termination and testing codes: e.g. AR235RAP471JPZ.
  2. Inductance measured using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
  3. Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.
  • S = Tin-lead (63/37) over leach-resistant silver-platinum-glass frit.
  • L = Silver-palladium-platinum-glass frit.

Testing:

  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
See FIT/MTBF Calculations

Performance curves

Typical L vs Frequency

Typical L vs Frequency

Typical Q vs Frequency

Typical Q vs Frequency

Typical Impedance vs Frequency

Typical Impedance vs Frequency

Physical characteristics

st235rap_dim.PNG

General specification

Core Material:
Ceramic
Weight:
0.7 – 1.3 mg
Packaging:
2000 per 7″ reel. Paper tape: 8 mm wide, 0.66 mm thick, 2 mm pocket spacing
Temperature coefficient of inductance:
+25 to +150 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.