Datasheet 3D Model
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Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%)
900 MHz 1.7 GHz 2.4 GHz Q min
@ 250 MHz 3
SRF min (GHz) 4 DCR max (Ω) 5 Imax (mA)
L typ Q typ 3 L typ Q typ 3 L typ Q typ 3
ST145RAP27NXJRZ 27 26.9 35 28.2 47 30.5 55 14 3.20 1.03 125
  1. When ordering, please specify termination and screening codes: e.g. ST145RAP51NJRZ.
  2. Inductance measured at 250 MHz using a Coilcraft SMD-F fixture in an Agilent/HP 4982 impedance analyzer with Coilcraft-provided correlation pieces.
  3. Q measured using an Agilent/HP 4991A with an Agilent/HP 16197 test fixture.
  4. SRF measured using an Agilent/HP 8722ES network analyzer and a Coilcraft CCF1235 test fixture.
  5. DCR measured on a micro-ohmmeter and a Coilcraft CCF1099 test fixture.


  • R=Tin over nickel over moly-mag.
  • P=Tin-lead (63/37) over tin over nickel over moly-mag.
  • Q=Tin-silver-copper (95.5/4/0.5) over tin over nickel over moly-mag.


  • Z = Unscreened
  • = Coilcraft CP-SA-10001 Group A
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Ambient temperature range:
–40°C to +85°C with Irms current.
Storage temperature range:
Component: –55°C to +125°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+125°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Impedance vs Frequency

L vs Frequency

Q vs Frequency

Physical characteristics


General specification

Core Material:
0.14 – 0.23 mg
2000 per 7″ reel. Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +150 ppm/°C.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.