Datasheet 3D Model
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Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%)
900 MHz 1.7 GHz Q min
@ 250 MHz 3
SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
L typ Q typ 3 L typ Q typ 3
ST145RAN8N0JRZ 8.0 7.65 35 7.68 53 15 > 5000 0.300 200
  1. When ordering, please specify termination and screening codes: e.g. ST145RAN7N1JRZ.
  2. Inductance measured at 25 MHz using a Coilcraft SMD-F fixture in
    an Agilent/HP 4286 impedance analyzer or equivalent with Coilcraftprovided
    correlation pieces.
  3. Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A
    test fixture or equivalents.
  4. SRF is measured on an Agilent 8753ES (or equivalent) with a Coilcraft
    CCF1235 test fixture.
  5. DCR is measured on a Keithley 580 Micro-ohmmeter (or equivalent)
    with a Coilcraft CCF1099 test fixture.


  • R = Matte tin over nickel over silver-platinum glass frit.
  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • Q= Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.


  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
    • Screening performed to the document’s latest revision.
    • Lot qualification (Group B) available.
    • Custom testing also available.
    • Country of origin restrictions available; prefix option G.
Ambient temperature range:
–40°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +140°C.
Packaging: –40°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics


General specification

Core Material:
0.14 – 0.23 mg
2000 per 7″ reel. Paper tape: 8 mm wide, 0.6 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.