Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (nH)
2
(Tolerance: ± 5%) |
900 MHz | 1.7 GHz |
Q min
@ 250 MHz 3 |
SRF min (MHz) 4 | DCR max (Ω) 5 | Imax (mA) | ||
|---|---|---|---|---|---|---|---|---|---|
| L typ | Q typ 3 | L typ | Q typ 3 | ||||||
| ST145RAN7N9JRZ | 7.9 | 7.56 | 38 | 7.56 | 58 | 16 | > 5000 | 0.300 | 200 |
Notes
- When ordering, please specify termination and screening codes: e.g. ST145RAN7N1JRZ.
- Inductance measured at 25 MHz using a Coilcraft SMD-F fixture in
an Agilent/HP 4286 impedance analyzer or equivalent with Coilcraftprovided
correlation pieces. - Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A
test fixture or equivalents. - SRF is measured on an Agilent 8753ES (or equivalent) with a Coilcraft
CCF1235 test fixture. - DCR is measured on a Keithley 580 Micro-ohmmeter (or equivalent)
with a Coilcraft CCF1099 test fixture.
Termination:
- R = Matte tin over nickel over silver-platinum glass frit.
- P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
- Q= Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
- Country of origin restrictions available; prefix option G.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +140°C.
Packaging: –40°C to +80°C.
Packaging: –40°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
0.14 – 0.23 mg
Packaging:
2000 per 7″ reel. Paper tape: 8 mm wide, 0.6 mm thick, 2 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +125 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.