Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (nH)
2
(Tolerance: ± 5%) |
900 MHz | 1.7 GHz | 2.4 GHz |
Q min
@ 250 MHz 3 |
SRF min (MHz) 4 | DCR max (mΩ) 5 | Imax at 125°C (mA) 6 |
|---|---|---|---|---|---|---|---|---|
| Q typ 3 | Q typ 3 | Q typ 3 | ||||||
| ST146RAA5N3JRZ | 5.3 | 29 | 40 | 47 | 12 | 5000 | 430 | 50 |
Notes
- When ordering, specify termination and screening codes: e.g. ST146RAA24NJRZ.
- Inductance measured at 250 MHz using an Agilent 4286A (or equivalent) with a Coilcraft CCF1426 test fixture using the listed correlation.
- Q is measured at 250 MHz on an Agilent 4991 (or equivalent) with a Coilcraft CCF1481 test fixture.
- SRF is measured on an Agilent 8753ES (or equivalent) with a Coilcraft CCF1406 test fixture.
- DCR is measured on a Keithley 580 Micro-ohmmeter (or equivalent) with a Coilcraft CCF1099 test fixture.
- Maximum current that can be applied at 125°C.
Termination:
- R = Matte tin over nickel over silver-platinum glass frit
- P = Tin-lead (63/37) over tin over nickel over silver platinum-glass frit
- Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- Screening performed to the document’s latest revision.
- Custom testing also available.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +140°C.
Packaging: –55°C to +80°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
Q vs Frequency
Physical characteristics
Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0.064 mm to E and 0.006 in / 0.15 mm to A and C.
| A max | B max | C max | D ref | E ref | F ref | G ref | H ref | |
| 0.019 | 0.011 | 0.0138 | 0.0035 | 0.008 | 0.006 | 0.009 | 0.012 | inches |
| 0,47 | 0,28 | 0,35 | 0,09 | 0,20 | 0,15 | 0,23 | 0,30 | mm |
General specification
Core Material:
Ceramic
Weight:
0.10 – 0.16 mg
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +155 ppm/°C
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.