Datasheet 3D Models
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Electrical specifications at 25°C.

Dual Conductor

Part number 1 Leads connected in parallel Leads connected in series
L (µH) 2
DCR ± 5% (mΩ) 3 SRF ref (GHz) 4 Isat (A) 5 Irms (A) 6 L (µH) 2
DCR max (mΩ) 3 SRF ref (GHz) 4 Isat (A) 5 Irms (A) 6
ST515PMD101MLZ 0.100 0.209 3.75 20 38 0.400 1.000 0.95 8 17
  1. When ordering, specify conductorstermination and screening codes: e.g. ST515PMM101MLZ.
  2. Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4263B LCR meter or equivalent.
  3. DCR is measured on a micro-ohmmeter at points indicated in the diagram.
  4. This information is for design purposes only and shall not be tested during screening.
  5. DC current at 25°C that causes a 20% (typ) inductance drop from its value without current.
  6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.


  • L = Matte tin over nickel over copper.
  • T = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
  • S = Tin-lead (63/37). (Special order, added cost)


  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Group A screening per Coilcraft CP-SA-10001
  • G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
All screening performed to the document’s latest revision.
Custom screening also available.
Ambient temperature range:
–40°C to +85°C with (40°C rise) Irms current.
Storage temperature range:
Component: –55°C to +125°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+125°C (ambient + temp rise). Derating.
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Current - Single Conductor

Typical L vs Current - Dual Conductor

Typical L vs Frequency - Single Conductor

Typical L vs Frequency - Dual Conductor

Typical Temperature Rise vs Current

Current Derating

Physical characteristics

Dimensions - Single Conductor

Dimensions - Dual Conductor

1. Dimensions are in inches/mm.
2. Dimensions are before optional solder application. For maximum overall dimensions including solder, add 0.0025 in / 0.064 mm to the length, and 0.006 in / 0.15 mm to the height.
3. Top surface is divided by a slot which should be considered when handled by a vacuum pick-and-place process.

General specification

Core Material:
0.44 - 0.47 g
500/7″ reel; Plastic tape: 16 mm wide, 0.33 mm thick, 12 mm pocket spacing, 3.12 mm pocket depth.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.